LED Mounting Package Through Wiring Thermal Pathway
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Solution Overview
Problem
Existing light-emitting element packages face inefficiencies in heat transfer from LEDs to radiator plates due to insufficient heat radiation routes, leading to ineffective heat dissipation.
Innovation Solution
A light-emitting element mounting package design featuring a flexible insulating resin substrate with through wirings and plating films that electrically connect LEDs to a metallic radiator plate, enhancing heat radiation by using through wirings as both electrical and thermal pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a radiator plate is provided at a portion corresponding to the mounting position of LED groups, then heat radiation capability is improved, but heat transfer efficiency from LEDs to radiator plate deteriorates due to insufficient heat radiation route
Solution Approach 1:
The patent combines the electrical connection function and heat dissipation function into a single metallic member (substrate or wiring board). This metallic member serves dual purposes: providing electrical connections to the LED groups and acting as a heat radiation route to transfer heat away from the LEDs, thereby resolving the contradiction between heat radiation capability and heat transfer efficiency.
Solution Approach 2:
The metallic substrate or wiring board is designed to perform multiple functions simultaneously: it provides mechanical support, electrical connectivity, and thermal management. By making the substrate itself metallic with high thermal conductivity, the system achieves efficient heat transfer from LEDs to the radiator plate without requiring separate dedicated heat transfer components.
2Reliability
If through wirings are used for electrical connection, then electrical connectivity is improved, but structural complexity increases due to additional components
Solution Approach 1:
The patent merges the electrical connection function and heat dissipation function into a single metallic member (substrate or wiring board). This metallic member serves dual purposes: providing electrical connections to the LED groups and acting as a heat radiation route to transfer heat away from the LEDs, thereby resolving the contradiction between heat radiation capability and heat transfer efficiency.
Solution Approach 2:
The metallic substrate or wiring board is designed to perform multiple functions simultaneously: it provides mechanical support, electrical connectivity, and thermal management. By making the substrate itself metallic with high thermal conductivity, the system achieves efficient heat transfer from LEDs to the radiator plate without requiring separate dedicated heat transfer components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design efficiently transfers heat generated by LEDs to the radiator plate, improving heat radiation properties and maintaining connection reliability despite thermal expansion mismatches between components.
Implementation Method 1
heat emitted by the groups of LEDs cannot be efficiently transferred to the radiator plate
Implementation Method 2
a plurality of through wirings 51, 52, and a bus line 33, which are formed on both sides of the substrate 10 and penetrate the substrate 10, and a plating film 41, 42, 43, and 45
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate.