Burn-In Board Thermal Simulation Unit for Package Heat Mapping
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Solution Overview
Problem
Existing methods fail to accurately simulate and measure heat distribution in semiconductor packages during testing without altering the test environment or equipment.
Innovation Solution
A semiconductor package heat generation simulation unit comprising a circuit board, heater, and temperature sensor, which can be connected to a burn-in board to measure and output temperature information, allowing simulation of heat distribution without modifying existing test facilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor package is tested in a heated environment to check temperature stress, then the reliability of the test is improved, but the ability to accurately measure and simulate heat distribution is insufficient
Solution Approach 1:
The patent creates a simulation unit that copies the thermal characteristics of a semiconductor package. The simulation unit includes a heater that generates heat similar to the semiconductor package and a temperature sensor that measures the heat distribution. This allows accurate measurement of temperature stress effects without requiring the actual semiconductor package, thereby improving both test reliability and measurement precision.
Solution Approach 2:
The patent introduces a simulation unit as an intermediary between the test environment and the measurement system. The simulation unit acts as a mediator that replicates the thermal behavior of the semiconductor package, enabling indirect but accurate measurement of heat distribution patterns that would otherwise be difficult to obtain.
2Ease of operation
If existing test equipment is used without modification to measure heat distribution, then the ease of operation is improved, but the measurement precision is insufficient
Solution Approach 1:
The simulation unit is designed with universal applicability to work with existing test equipment without requiring modifications. The heater and temperature sensor are configured to be compatible with standard test fixtures and measurement systems, allowing the same equipment to serve both its original testing function and the new heat distribution measurement function, thereby maintaining ease of operation while achieving precise measurements.
3Measurement precision
If the test environment is modified to improve heat distribution measurement, then the measurement precision is improved, but the device complexity increases
Solution Approach 1:
The simulation unit is segmented into distinct functional modules: a heater component that generates heat, a temperature sensor component that measures temperature, and a simulation unit that integrates these components. This segmentation allows each component to be independently optimized and easily integrated into existing test equipment, improving measurement precision without significantly increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate simulation of heat distribution in semiconductor packages using existing test equipment, facilitating improved testing conditions without additional setup costs.
Implementation Method 1
a heater configured to generate heat by power input through the power terminal
Implementation Method 2
a temperature sensor configured to measure a temperature of heat generated by the heater and output temperature information on the temperature through the signal terminal
Data Source
AI summary
Provided are a semiconductor package heat generation simulation unit for checking heat distribution of a burn-in board and a method for acquiring heat distribution of a burn-in board using the same, the unit including: a circuit board including input/output terminals each corresponding to a conductive part of a socket of the burn-in board, and a power terminal and a signal terminal, connected to the input/output terminals; a heater configured to generate heat by power input through the power terminal; and a temperature sensor configured to measure a temperature of heat generated by the heater and output temperature information on the temperature through the signal terminal.