Integrated back-gate diodes in FDSOI substrates monitor RF power amplifier temperature without extra masks, enabling bias-based cooling.
A folded case holds the flexible PCB branch to prevent vibration-induced stress and contact, extending temperature sensor lifespan.
A migrating temperature-responsive material creates a delayed capacitance shift, revealing prolonged overheating of sensitive products.
RF tags and multi-sensor monitoring automate handwashing checks, temperature alerts, and expiration labeling to reduce contamination risk.
Different LED and photodiode bias currents use ΔVBE to estimate user temperature while reducing skin contact and strain errors.
Temperature-based gain and pulse-current adjustment help optical distance sensing stay stable for low- and high-reflectance targets.
A heater and temperature sensor unit simulates semiconductor package heat on burn-in boards, enabling accurate thermal mapping with existing test equipment.
A one-step thermocouple installation joins the positioning pad and shielding to improve surface temperature accuracy and long-term stability.
An ultrasonic bung waveguide measures wine cask headspace without contact, filtering false echoes and avoiding complex calibration.
A resilient attachment pad protects pipe-mounted strain gauges from moisture, pressure, and breakage for lower-cost monitoring.
Optical temperature signals replace complex PCB routing in server fan control, improving response speed and reducing interference.
Floating or IR surface temperature sensing keeps liquid precursor vapor pressure stable and helps prevent condensation in semiconductor source vessels.
A multilayer heat shield keeps display electronics cooler while a probe measures cavity temperature and transmits readings wirelessly.
A high-thermo-optic sensing element and reflective surfaces improve localized temperature sensing while limiting fiber bending errors.
A modular force-torque sensor uses a mechanical amplifier instead of strain gauges to keep high resolution and replace only the overloaded deformation body.
Discrete fiber segments with high thermo-optic sensing elements improve localized temperature measurement by reducing bend-induced strain errors.
A modular coupling and mechanical amplifier isolate overload from the sensing path, cutting replacement cost while preserving force-torque accuracy.
A split housing doubles as charging electrodes and a heat dissipation path, protecting the circuit board in high-temperature food measurement.
Temperature sensing and coordinated UART baud updates keep SoC links aligned across thermal changes, reducing transmission errors.