Burn-In Board Seating Assembly for Reliable Connector Latching

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Solution Overview

Problem

Semiconductor devices often fail prematurely due to undetected defects, and existing burn-in test systems lack efficient mechanisms for establishing reliable electrical connections and maintaining consistent temperature during testing, which can lead to damage of functioning chips.

Innovation Solution

The semiconductor burn-in oven employs a seating assembly with a main frame actuator, hook members, and a hook driver to establish and secure electrical connections between burn-in boards and testing circuitry, while a heating device and heat exchange system maintain the desired temperature, preventing overheating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If burn-in boards are inserted into the chamber, then electrical connections can be established with testing circuitry, but inconsistent connections may lead to testing failures

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidseating mechanism complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A seating assembly acts as an intermediary mechanism between the burn-in boards and the testing circuitry. The assembly includes a main frame with circuit connectors that interface with board connectors, and hook members that secure the boards in place. This intermediary structure ensures consistent and reliable electrical connections while maintaining a manageable level of mechanical complexity through modular design.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If temperature is increased for burn-in testing, then device reliability can be assessed, but overheating can damage properly functioning chips

Engineering Contradiction:
Improvetesting temperatureVSAvoidoverheating damage
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The burn-in test system incorporates temperature monitoring and control mechanisms that provide feedback during the testing process. Temperature sensors monitor the thermal conditions within the chamber, and the system adjusts heating and cooling operations to maintain temperatures within safe operating ranges. This feedback loop enables reliable assessment of device reliability through elevated temperature testing while preventing damage to properly functioning chips by avoiding excessive overheating.

Inventive Principle:
Principle #23Feedback

3Stability of the object's composition

If hook members are added to secure burn-in boards, then board positioning stability is improved, but the seating assembly becomes more complex

Engineering Contradiction:
Improveboard positioning stabilityVSAvoidseating assembly structure
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The seating assembly is segmented into distinct functional components: a main frame structure providing support and circuit connectivity, multiple hook members for board retention, and actuators for controlled operation. Each hook member is an independent element that can be individually actuated to engage or disengage from the burn-in board. This segmentation provides stable board positioning through multiple discrete attachment points while keeping the overall assembly manageable through modular, independently controllable elements.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables reliable testing of semiconductor devices by ensuring consistent electrical connections and precise temperature control, effectively identifying and preventing premature failures in semiconductor devices.

Implementation Method 1

a heating device configured to heat the chamber

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

heat exchange systems are employed to maintain the chips within a desired temperature range to prevent overheating of the chips

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS12007434B2Burn-in board seating
Publication Date: 2024.06.11 MICRO CONTROL COMPANY
  • US12007434B2 patent drawing
  • US12007434B2 patent drawing
  • US12007434B2 patent drawing

AI summary

A semiconductor burn-in oven includes a housing having a chamber, a heating device, testing circuitry having circuit connectors, and a seating assembly. The seating assembly includes a main frame, a main frame actuator connected to the main frame, a plurality of hook members connected to the main frame, and a hook driver. The main frame actuator is configured to drive movement of the main frame along a first axis between an extended position and a retracted position. The hook driver is configured to pivot each of the hook members about a pivot axis between a receiving position and a latching position. Board connectors of burn-in boards supported within the chamber are driven to seat with the circuit connectors when the burn-in boards are latched by the hook members in their latching position and the main frame is moved from the extended position to the retracted position.