Integrated Circuit Testing TRIZ Cases
- Burn-In Board Seating Assembly for Reliable Connector Latching
A hook-driven seating assembly secures burn-in boards to testing connectors while controlled chamber heating prevents chip overheating.
- Optical DUT Test Fixture With Short Spring Pins and Heat Sink Arm
Short spring pins, a heat-sink arm, and precise X-Y-Z alignment enable non-destructive optical DUT testing with up to 90 GHz bandwidth.
- FPGA-Based ASIC Test Board with Detachable Socket Interface
A reconfigurable FPGA test board uses a detachable chip socket to test different ASICs on one PCB, reducing dedicated board needs.
- Block-Based DVS Wafer Testing Using Temperature-Correlated Voltage
Block-specific DVS voltages are set from measured and predicted temperatures to cut DPPM and improve wafer reliability.
- Semiconductor Test Correlation for Wafer-to-Package Variation Detection
Correlating wafer and package test data reveals variation-driving factors early, cutting unnecessary semiconductor testing time and cost.
- Semiconductor Wafer Test Power Control Between Ready and Waiting Modes
An operating server switches wafer test hardware between ready and waiting modes to cut idle power while preserving rapid test resumption.
- Semiconductor Testing Apparatus with APCM Leakage Control
An auxiliary control circuit equalizes deactivated switch terminals to suppress leakage current during semiconductor testing.
- Software-Defined IC Variants for Defect-Tolerant Routing
This case assigns defective integrated circuits to software-defined variants whose segmented deactivated regions preserve signal routing and improve yield.
- 3D IC I/O Multiplexing for Compact, X-Free Chip Testing
Through-silicon-via I/O multiplexing supports independent stacked-chip testing, reducing area and preventing X-propagation.
- Block-Based Dynamic Voltage Stress Wafer Testing With Adaptive Voltages
Temperature correlations set block-specific DVS voltages, improving wafer test accuracy and reducing high DPPM rates.
- Block-Specific Dynamic Voltage Stress Optimization for Wafer Testing
Fixed voltage overlooks block differences; temperature-correlated DVS targets tailor wafer stress and improve testing accuracy and yield.
- Burn-In Chamber Frame Alignment and Thermal Sealing on Uneven Floors
This case uses progressive frame alignment and flexible thermal seals to prevent board damage and leakage during chamber docking.
- Kill Die Subroutine for Semiconductor Parametric Failure Detection
A kill die subroutine transforms parametric failures into continuity failures during probe testing.
- Burn-in Board Management System with Automated Slot Suspension
Automated burn-in board management system generates status maps to suspend boards with malfunctioned slots, reducing manual errors and costs.
- DUT Container Shape Correction for Thermal Deformation
A handling apparatus corrects three-dimensional shape data of DUT containers using reference points to determine accommodation states.
- Gradient Thermal Analysis for 3D Defect Localization
Laser-induced thermal gradients propagate through stacked die structures, enabling precise three-dimensional fault isolation without destructive testing.