Burn-In Chamber Frame Alignment and Thermal Sealing on Uneven Floors
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Solution Overview
Problem
The misalignment and misalignment-induced damage of burn-in boards due to uneven ground surfaces, and the difficulty in achieving complete thermal sealing between the interchangeable frame and the burn-in chamber, leading to potential leaks and wear, are unresolved issues in existing burn-in apparatus.
Innovation Solution
A burn-in apparatus with cooperating alignment elements and thermal insulation side elements that progressively couple to lift the frame into alignment and seal the chamber, independent of ground surface conditions, ensuring accurate board insertion and effective thermal insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the burn-in chamber is placed on an uneven ground surface, then the apparatus can be installed flexibly, but misalignment between burn-in boards and receiving connectors occurs
Solution Approach 1:
The patent applies preliminary action by providing preliminary alignment elements (alignment pins and alignment holes) that pre-establish the correct alignment relationship between the burn-in chamber and interchangeable frame before the docking process. This ensures that even when placed on uneven ground surfaces, the components will align properly during the docking operation, resolving the contradiction between installation flexibility and alignment precision.
2Reliability
If thermal insulation side elements are made high to ensure complete sealing, then thermal sealing is improved, but friction and wear during docking increase
Solution Approach 1:
The patent employs flexible shells and thin films by using flexible sealing members (such as O-rings or elastomeric seals) as the thermal insulation side elements. These flexible sealing members can deform to ensure complete thermal sealing between the burn-in chamber and interchangeable frame, while their flexibility reduces the friction and wear that would occur with rigid high insulation elements, thus resolving the contradiction between thermal sealing reliability and friction-induced wear.
3Manufacturing precision
If alignment elements are made rigid to ensure precise alignment, then alignment precision is improved, but tolerance for ground unevenness decreases
Solution Approach 1:
The patent applies the intermediary principle by introducing adjustable alignment elements that act as mediators between the rigid burn-in chamber and the potentially uneven ground surface. These alignment elements can be adjusted in length or position to compensate for ground unevenness while still providing precise alignment, thus resolving the contradiction between alignment precision and ground surface adaptability.
Data Source
AI summary
The present disclosure relates to burn-in apparatus, transfer method, burn-in chamber, and interchangeable frame thereof for semiconductor devices burn-in process. The burn-in apparatus comprises a burn-in chamber with an incomplete base which is to be completed and thermally insulated in cooperation with a thermal insulation base of at least one interchangeable frame which is to be removably moved into and docked in the chamber to complete the burn-in apparatus. Cooperating alignment elements are respectively arranged at the frame and the chamber, and configured to progressively and movably couple to each other to lift the frame to bring a set of burn-in boards that are supported on the frame into alignment for insertion into a set of receiving connectors in the chamber. Cooperating thermal insulation side elements may be respectively arranged at the frame and the chamber, and include complementary characteristics configured to provide a clearance gap between the thermal insulation side elements when they partially overlap each other and an abutting fit when they substantially or fully overlap each other.