FPGA-Based ASIC Test Board with Detachable Socket Interface

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Solution Overview

Problem

Existing technologies require dedicated test boards for each ASIC chip design, making it impractical for universities and research institutions to test various ASIC chips, and there is a need for a flexible testing solution that can accommodate different ASIC chips with a single test board.

Innovation Solution

A circuit device incorporating a field-programmable gate array (FPGA) that allows for detachable connection of ASIC chips to a PCB, enabling customizable test codes and signals, along with a power supply and communication module for real-time analysis.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a dedicated test board is used for each ASIC chip design, then testing accuracy is improved, but device complexity and cost increase

Engineering Contradiction:
Improvetesting accuracyVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The test board is designed with a universal interface that can accommodate multiple different ASIC chip designs through a standardized socket connection system. The reconfigurable logic circuit allows the same physical test board to be programmed for different testing scenarios, eliminating the need for dedicated test boards for each chip design while maintaining testing accuracy.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The test board incorporates a reconfigurable logic circuit that can be dynamically programmed to adapt to different ASIC chip designs. This dynamic reconfiguration capability allows the testing system to change its functionality based on the specific chip being tested, providing both universality and precision without requiring multiple fixed test boards.

Inventive Principle:
Principle #15Dynamics

2Reliability

If multiple dedicated test boards are manufactured for different ASIC chips, then testing reliability is improved, but loss of substance and cost increase

Engineering Contradiction:
Improvetesting reliabilityVSAvoidloss of substance
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

A single test board is designed to serve multiple ASIC chip designs through universal interfaces and reconfigurable logic circuits. This eliminates the need to manufacture multiple dedicated test boards, reducing material consumption and waste while maintaining testing reliability through programmable test sequences and configurable testing parameters.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Instead of discarding or storing multiple dedicated test boards, the system recovers resources by using a single reconfigurable test board that can be reprogrammed for different chips. This reduces material waste and allows the same physical hardware to be continuously reused across different testing projects.

Inventive Principle:
Principle #34Discarding and recovering

3Ease of operation

If a single test board is used for various ASIC chips, then ease of operation is improved, but measurement precision may deteriorate

Engineering Contradiction:
Improveease of operationVSAvoidmeasurement precision
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The reconfigurable logic circuit is programmed with specific test sequences and parameters tailored to each ASIC chip design, ensuring measurement precision is maintained despite using a universal test board. The system dynamically adapts its testing methodology to match the specific requirements of each chip being tested.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The test board provides customized testing capabilities for each specific ASIC chip design through local configuration of the reconfigurable logic circuit. Each chip type receives dedicated test sequences and parameters optimized for its specific requirements, ensuring precision while maintaining the ease of operation of a single universal test board.

Inventive Principle:
Principle #3Local quality

4Manufacturing precision

If dedicated test boards are required for each ASIC design, then manufacturing precision is improved, but device complexity and productivity decrease

Engineering Contradiction:
Improvemanufacturing precisionVSAvoidproductivity
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The universal test board with reconfigurable logic circuits can test multiple different ASIC chip designs with the same level of manufacturing precision. By eliminating the need to manufacture and maintain multiple dedicated test boards, the system improves productivity while maintaining precision through programmable testing capabilities that adapt to each chip's specific requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20260104448A1Circuit device for testing semiconductor device and method of operating the same
Publication Date: 2026.04.16 UX FACTORY CO LTD
  • US20260104448A1 patent drawing
  • US20260104448A1 patent drawing
  • US20260104448A1 patent drawing

AI summary

Disclosed herein are a circuit device for testing a semiconductor device and a method of operating the same. The circuit device includes: a printed circuit board (PCB); a chip socket configured to electrically connect a first semiconductor device to be tested to the PCB in a detachable manner; a second semiconductor device configured to be fixed to the PCB, such that a test code is uploaded thereto, and to apply a test signal to the first semiconductor device according to an operation of the test code and analyze an output signal received from the first semiconductor device; a communication module configured to be fixed to the PCB, to connect an external computing device and the second semiconductor device, and to selectively transmit and receive the test code and analysis results; and a power supply module configured to be fixed to the PCB, and to supply power.