Burn-In Test Chamber Airflow Distribution for Temperature Uniformity
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Solution Overview
Problem
Existing burn-in tests for semiconductor packages face challenges due to non-uniform temperature distribution and airflow within the test chamber, leading to reduced reliability and accuracy of inspection results.
Innovation Solution
A test apparatus with a design that includes inclined plates and flow distributors within a supply duct to uniformly distribute air flow and maintain consistent temperature across multiple racks of burn-in boards, using a circulator to control and circulate air for uniform thermal stress application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal stress is applied by circulating high or low temperature air into the test room, then the burn-in test can be performed to check lifespan and malfunction, but the flow rate of air changes causing temperature deviation and reducing inspection accuracy
Solution Approach 1:
The patent applies local quality by providing dedicated flow distributors for different rack positions (first flow distributor for first rack, second flow distributor for second rack) and using inclined plates at specific locations to control airflow distribution. Each rack receives optimized airflow independently, ensuring uniform temperature distribution across different vertical positions while maintaining test reliability.
Solution Approach 2:
The inclined plates act as intermediary elements between the air supply and the burn-in boards. These plates modify the airflow pattern by extending in an inclined manner toward the bottom of each rack, creating a mediator that distributes thermal stress more uniformly and prevents direct temperature variations from affecting inspection accuracy.
2Productivity
If multiple burn-in boards are arranged along the vertical direction in a single test room to increase test capacity, then productivity increases, but temperature uniformity deteriorates creating different test environments locally
Solution Approach 1:
The patent segments the airflow control system into distinct first and second flow distributors, each corresponding to a specific rack. This segmentation allows independent optimization of airflow for each vertical section, maintaining temperature uniformity across multiple burn-in boards arranged vertically while supporting increased test capacity through multiple racks.
Solution Approach 2:
By providing localized flow distributors and inclined plates for each rack position, the system ensures that each vertical section receives appropriately distributed airflow. This local quality control maintains temperature uniformity within each rack's environment, enabling multiple racks to operate with consistent test conditions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances airflow uniformity and temperature consistency, improving the reliability and accuracy of burn-in tests by ensuring uniform thermal stress application across all semiconductor packages.
Implementation Method 1
thermal stress is applied to the semiconductor package to be inspected by circulating high or low temperature air as an inspection fluid into a test room where the semiconductor package to be inspected is received
Data Source
AI summary
A test apparatus includes a test chamber; a first rack supporting a plurality of first burn in boards stacked in a first direction; a second rack on top of the first rack, and configured to support a plurality of second burn in boards stacked in the first direction; and a supply duct on a first wall in the second direction of the test chamber. The supply duct includes a first flow distributor including at least one first inclined plate overlapping the plurality of first burn in boards, and extending in an inclined manner toward a bottom of the first rack. The second flow distributor includes at least one second inclined plate spaced apart from the at least one first inclined plate in the first direction, overlapping the plurality of second burn in boards in the second direction, and extending in an inclined manner toward a bottom of the second rack.