Bus Bar Heat Dissipation Structure for Electronic Devices
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Solution Overview
Problem
Conventional electronic devices with bus bars struggle to efficiently dissipate heat generated by high-power electronic parts, leading to temperature increases that can cause false operations, distortion, and noise, especially in high-heat-generating components like those found in power converters and electric vehicles.
Innovation Solution
The electronic device incorporates a layered structure with a first bus bar for power lines and a second bus bar connected to a heat dissipation member, with insulating heat transfer members between them to expand the heat dissipation path, allowing for efficient heat transfer from high-heat-generating parts to the heat dissipation member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional heat dissipation structure with local contact portions is used, then the structure is simple, but heat transfer to the whole heat dissipation member is difficult and heat dissipation efficiency is low
Solution Approach 1:
The invention transitions from local point-contact heat transfer to plane-to-plane contact heat transfer by placing the heat dissipation member in direct contact with the circuit board over a large area. This dimensional change from 0D/1D contact to 2D contact dramatically increases the heat transfer area and efficiency while maintaining structural simplicity.
2Loss of energy
If the surface area of the heat dissipation area is increased to enhance heat dissipation capability, then heat dissipation performance improves, but the board size becomes large
Solution Approach 1:
The circuit board serves multiple functions: it provides electrical connections and simultaneously acts as a heat dissipation member through its large surface area in contact with the heat dissipation structure. This multi-functionality eliminates the need for separate large-area heat dissipation components, achieving excellent heat dissipation without increasing board size.
3Device complexity
If conventional heat dissipation means are used for high-heat-generating electronic parts, then the structure remains simple, but heat dissipation is insufficient and temperature increase causes operational issues
Solution Approach 1:
The invention segments the heat dissipation function into two parts: the circuit board provides the heat transfer path through its substrate, and the heat dissipation member (with high heat dissipation coefficient material) provides efficient heat dissipation. This segmentation allows each component to perform its function optimally while maintaining overall structural simplicity and improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation performance by utilizing the entire surface area of the heat dissipation member, reducing temperature increases, and preventing operational issues, while also optimizing design parameters for space and cost savings.
Implementation Method 1
an insulating heat transfer member placed between the first and second bus bars
Data Source
AI summary
A structure for efficiently transferring heat generated from an electronic part or the like to a heat dissipation member is provided. A bus bar is used for a wiring pattern in an electronic device (60), such as a power line (2), a GND line (6) and the like. A heat transfer member (25) is held between a first bus bar that is a power line (2) connected to an electronic part and a second bus bar that is a GND line (6) connected to a heat dissipation member (7) to configure a heat dissipation structure in which heat generated from the electronic part is transferred through the power line (2), the heat transfer member (25) and the GND line (6) to the heat dissipation member (7).