Printed Circuit Aspects TRIZ Cases

Pre-weaved conductive yarns allow discrete component mounting, resolving device choice flexibility limits in wearable textiles.

Thermoplastic polyimide insulation eliminates adhesive application steps by bonding directly to flexure elements through thermal activation.

Titanium-dispersed conductive ink eliminates expensive vacuum sputtering while ensuring strong adhesion between the copper layer and base film.

Thermal interface materials route heat between stacked printed circuit boards, resolving airflow blockage in dense electronics.

A flexible substrate with a projecting portion and second connecting portion enables circuit connection.

Connecting parallel branch secondaries through a series inductor reduces voltage jump frequencies, minimizing radiation interferences and common-mode currents.

Aligning primary and secondary sub-coil averages on distinct layer planes prevents output voltage drops caused by inconsistent coil clearances.

Laser ablation forms channels in catalytic core material for electroless copper plating, resolving impedance control issues from varying dielectric spacing.

A printed circuit board uses superconducting tracks to transmit electrical energy directly to power electronics systems.

Integrated photolithography using dual-wavelength photoresist layers aligns vias with wirings, eliminating misalignment from independent process steps.

A printed wiring board uses a conductive recognition mark connected via vias to generate mode switching signals.

Radial flange-shaped projecting parts on a shaft conductor distribute current paths to handle circular polarization across various orientations.

Cured plugging ink fills substrate cavities to secure embedded electronic components, eliminating voids that cause delamination under thermal stress.

Thermally conductive portions fill gaps between conductor tabs to create connection grooves for heat dissipation.

Functionally graded thermal vias connect embedded PCB winding layers to a cold plate, reducing thermal resistance caused by low conductivity FR-4 materials.

Edge wrap metallization routes microstrip lines to a ball grid array, enabling standard solder reflow mounting for complex circulators.

Segmented insulating and thermally conductive adhesives prevent short circuits while enhancing heat dissipation efficiency.

Dual-side wire routing on a substrate reduces occupied area, enhancing connection stability while resolving manufacturing complexity from wire crossings.

A laminated printed circuit board with specific thermal and hygroscopic expansion coefficients constrains dimensional changes along the optical axis.

Direct bonding of a flexible resin layer to a heat dissipation structure eliminates adhesive complexity while achieving 8-10°C lower temperatures.

Curved printed circuit boards follow disk shroud arcs to separate vibration sensors from capacitors, eliminating false detection signals.

Segmented outlines with asymmetric positioning reduce material waste while increasing the number of PCBs produced per base plate.

A display module uses dual flexible printed circuit boards to distribute driving signals across the panel.

A force sensing dome switch integrates a resistive element to function as a variable resistor alongside standard switching capabilities.

A printed circuit board uses a raised conductive post on an interconnect bridge to form a connection pad within a recessed insulating layer.

A metal foil uses a separable bearing layer to maintain conductive line height during manufacturing.

A bus bar heat dissipation structure transfers thermal energy from power lines to ground lines through an insulating member.

An isothermal cage on the printed circuit board maintains uniform temperature across infrared sensors.

Segmented pad electrodes with varying widths prevent short circuits and ensure stable electrical coupling between the driver and substrate.

A rigid bus bar body connects to a flexible portion with lower elasticity to form conductive pathways between electronic devices.

UV-cured SU-8 stress layers on nanocellulose substrates enable autonomous PCB folding, bypassing energy-intensive 4D printing methods.

Segmented conductive contact rows on a PCB enable multiple memory channels, increasing bandwidth without adding data buffers.

Segmented profiles with universal clamping tongues enable quick module installation while reducing structural complexity.

A modified module socket mechanism routes high-speed data directly to a processor module via dedicated electrical contacts on a printed circuit board.

An adjustment structure with specific thermal expansion properties reduces warpage caused by mismatched material coefficients.

An insulating etch stop pattern counters inclined sidewalls during reactive ion etching, enabling fine-pitch via structures with less than 30 μm spacing.

A duct arranged parallel to a circuit board channels forced air from separate inlets to an outlet, cooling heat sources within a compact image capture body.

Uniform dummy patterns in PCB dummy areas prevent over-grinding and plating thickness differences during buried circuit formation.

A light emitting diode module uses a heat releasing member protruding through the printed circuit board.

Segmented flexible printed circuits widen line intervals to lower parasitic capacitance and boost conversion efficiency.

Positioning connection pads on long sides prevents misalignment between the digitizer and flexible circuit board.

Additional conducting blades integrate a resistive measurement circuit to verify compression state, preventing unreliable electrical contact during assembly.

A flexible circuit film with overlapping lead bonding portions electrically connects a chip to a display panel.

Embedding a magnetic layer within core and build-up layers maintains high permeability at elevated switching frequencies while reducing package area.

A conductive bonding member joins the backlight and liquid crystal panel while connecting to a substrate conductive layer for stable grounding.

Flexible voltage taps absorb mechanical loads from static and dynamic displacements, preventing connection breaks in energy storage modules.

Remove capture pads from via holes using through drilling to eliminate signal reflection and improve analog performance.

Localized surface roughness profiles prevent short circuits between adjacent conductors while maintaining high adhesion strength on the insulation layer.