Modified Module Socket Bypassing Motherboard for High-Speed Data
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Solution Overview
Problem
Processor assembly modules are limited by the speed of the motherboard in data transmission, leading to suboptimal performance when high-speed communications are required, and mounting high-speed components on the module PCB can cause strain and premature failure due to force translation and compatibility issues with narrow pitches.
Innovation Solution
A modified module socket mechanism that allows high-speed communications to bypass the motherboard by mounting high-speed components directly on the socket, incorporating structural support and electrical connections to absorb forces and maintain contact without straining the module PCB, while accommodating components with varying pitches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high-speed components are mounted on the module PCB, then data transmission speed is improved, but the module PCB experiences strain and premature failure
Solution Approach 1:
A socket mechanism is introduced as an intermediary component between the module PCB and high-speed components. The socket absorbs mechanical forces and strain, preventing direct transmission of stress to the module PCB while maintaining electrical connectivity. This mediator allows high-speed components to be mounted without compromising the integrity or lifespan of the module PCB.
2Speed
If high-speed components are mounted on the module PCB, then communication speed is improved, but compatibility issues arise due to narrow pitch constraints
Solution Approach 1:
The socket mechanism is designed with universal compatibility to accommodate various high-speed components with different pitches. The socket provides standardized mounting and electrical connection interfaces that can adapt to different component types and pitch requirements, eliminating the narrow pitch constraints of the module PCB while maintaining high-speed communication capabilities.
3Device complexity
If the electrical connection travels through the motherboard, then system simplicity is maintained, but transmission speed is limited by motherboard capabilities
Solution Approach 1:
The electrical connection path is segmented into two separate pathways: standard connections continue to travel through the motherboard, while high-speed connections are routed directly from the socket to the module PCB. This segmentation allows the system to maintain simplicity for standard operations while providing a dedicated high-speed pathway for performance-critical communications.
Data Source
AI summary
A modified socket mechanism comprises a printed circuit board and a connector component located on a first face of the printed circuit board. The modified socket mechanism may comprise a first region of electrical contacts located on the first face. The first region of electrical contacts may be designed to interface with a processor module. The modified socket mechanism may also comprise a second region of electrical contacts located on a second face of the printed circuit board. The second region of electrical contacts may be designed to interface with a motherboard. The modified socket mechanism may also comprise a first electrical connection between the connector component and the first region of electrical contacts through the printed circuit board. Finally, the modified socket mechanism may also comprise a second electrical connection between the first region of electrical contacts and the second region of electrical contacts through the printed circuit board.