Plugging Ink Embeds Components in Substrate Cavities
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Solution Overview
Problem
Existing substrate manufacturing technologies face challenges in embedding electronic components, particularly with thick cores and large embedded components, as they often result in voids in dielectric material, leading to delamination and reduced performance or failure under thermal and mechanical stresses.
Innovation Solution
The use of a cured plugging ink is employed to securely embed electronic components within cavities of substrates, filling the regions between the component and cavity walls without voids, using inks like THP-100DX1 and PHP900 series, which are dispensed and cured to form a robust mounting structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional dielectric material is used to embed electronic components in thick core substrates, then the substrate structure is formed, but voids appear in the dielectric material leading to delamination and reduced reliability
Solution Approach 1:
The patent changes the material parameter from conventional dielectric material to plugging ink with specific rheological properties. The plugging ink's ability to flow and cure creates a void-free embedding medium that adheres properly to the substrate and electronic components, eliminating delamination issues while maintaining precise component positioning in thick core substrates.
Solution Approach 2:
The patent uses plugging ink as a composite embedding material that combines the benefits of dielectric properties with superior adhesion and void-free filling capabilities. This composite material approach resolves the contradiction by providing both the structural support needed for manufacturing precision and the adhesion properties needed for long-term reliability.
2Ease of manufacture
If electronic components are embedded in thick core substrates using conventional methods, then the substrate is formed, but the embedded components become vulnerable to thermal and mechanical stresses
Solution Approach 1:
The patent modifies the embedding material parameters by using plugging ink with controlled viscosity and curing characteristics. This material can be easily dispensed and filled into thick core substrates while maintaining component stability, and upon curing, provides enhanced mechanical support that protects components from thermal and mechanical stresses during operation.
Solution Approach 2:
The plugging ink provides beforehand cushioning by filling all void spaces around electronic components before curing. This creates a protective matrix that cushions components against subsequent thermal expansion and mechanical stresses, preventing damage before it occurs during device operation.
3Ease of manufacture
If dielectric material is used for component embedding, then the substrate structure is created, but voids form causing delamination under stress
Solution Approach 1:
The patent changes the material parameters from conventional dielectric to plugging ink, which has superior flow and adhesion properties. This enables complete filling of embedding regions without void formation, achieving both ease of manufacture through simple dispensing and high manufacturing precision through void-free, uniform filling that prevents delamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a void-free embedding of electronic components, enhancing their robustness and reducing the likelihood of delamination, thus improving the reliability and performance of the substrate under various stresses.
Implementation Method 1
The hole-plugging ink 550 is then subject to a curing process (e.g., a thermal curing process, an ultraviolet light curing process, etc.).
Implementation Method 2
providing a pressure differential between the upper opening of the cavity and the vent to draw the uncured hole-plugging ink 550 into the cavity 104.
Data Source
AI summary
In an aspect, an electronic device is disclosed that includes a substrate comprising a core having an upper planar surface and a lower planar surface, wherein the core includes a cavity extending between the upper planar surface of the core and the lower planar surface of the core; an electronic component at least partially disposed in the cavity, wherein the electronic component is at least partially surrounded in the cavity by a cured plugging ink, the electronic component including an upper planar surface having one or more electronic component terminals; and an upper metallization structure configured to provide one or more conductive paths from the one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.