Circuit Board Thermal Conduction via Insulating Layer Gaps

Solution Overview

Problem

The increasing challenge of heat dissipation on circuit boards in high-power and high-density electronic devices, where existing solutions either compromise wiring density or complicate assembly with additional heat dissipation components.

Innovation Solution

A circuit board design featuring a base layer, a transmission wire layer with conductor tabs, and an insulating and thermally conductive layer where the gaps between conductor tabs are filled with thermally conductive portions, creating a connection groove for enhanced heat dissipation without increasing the board's layout area or requiring additional components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If high-power and high-density electronic devices are used, then power and density increase, but heat dissipation becomes increasingly problematic

Engineering Contradiction:

ImprovepowerVSAvoidheat dissipation

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent merges the insulating layer and heat dissipation function into a single integrated structure. The insulating and thermally conductive layer combines electrical insulation with thermal conduction properties, eliminating the need for separate heat dissipation components while effectively managing heat from high-power devices

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses composite materials with both insulating and thermally conductive properties. The insulating and thermally conductive layer is formulated as a composite material that simultaneously provides electrical insulation to prevent short circuits and thermal conduction to dissipate heat efficiently

Inventive Principle:

Principle #40Composite materials

2Temperature

If additional heat dissipation components are added, then heat dissipation improves, but device complexity and assembly difficulty increase

Engineering Contradiction:

Improveheat dissipationVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the insulating layer and heat dissipation function into a single integrated structure. The insulating and thermally conductive layer combines electrical insulation with thermal conduction properties, eliminating the need for separate heat dissipation components while effectively managing heat from high-power devices

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The insulating and thermally conductive layer serves multiple functions simultaneously: it provides electrical insulation between conductive layers, conducts heat away from heat-generating components, and fills gaps between conductor tabs. This multi-functionality reduces overall device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Quantity of substance

If conductor tabs are placed closer together to increase wiring density, then wiring density improves, but heat dissipation between tabs becomes more difficult

Engineering Contradiction:

Improvewiring densityVSAvoidheat dissipation

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

The patent applies local quality by making the insulating and thermally conductive layer's thermal conductivity specifically high in the regions between conductor tabs. This localized thermal conduction property enables effective heat dissipation in the gaps between closely-spaced tabs without compromising the overall wiring density

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite materials with both insulating and thermally conductive properties. The insulating and thermally conductive layer is formulated as a composite material that simultaneously provides electrical insulation to prevent short circuits and thermal conduction to dissipate heat efficiently

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively dissipates heat generated by both the transmission wire layer and integrated components, such as chips, improving thermal performance while maintaining high-density wiring and miniaturization capabilities.

Implementation Method 1

an insulating and thermally conductive layer including multiple thermally conductive portions, wherein the gap between each two adjacent conductor tabs is filled with a corresponding thermally conductive portion

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12120810B2Circuit board and preparation method therefor

Publication Date: 2024.10.15 SHENNAN CIRCUITS

AI summary

Disclosed are a circuit board and its preparation method. The circuit board includes a base layer, a transmission wire layer including multiple conductor tabs, and an insulating and thermally conductive layer including multiple thermally conductive portions. A gap is defined between each adjacent two of the multiple conductor tabs to expose at least a portion of the base layer, and the gap is filled with a corresponding thermally conductive portion. A height of the thermally conductive portion is larger than heights of each adjacent two of the multiple conductor tabs to define a connection groove. The circuit board the disclosure providing enhances heat dissipation performance of circuit boards.