LED Module Heat Releasing Member Protruding Through PCB
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Solution Overview
Problem
Light emitting diode (LED) modules in display devices generate significant heat, leading to defects and reduced lifespan due to inadequate heat dissipation, affecting the performance and durability of the display devices.
Innovation Solution
A light emitting diode module design featuring a heat releasing member that protrudes from the module's body and passes through a printed circuit board, allowing for efficient heat dissipation by exposing the heat releasing member on the outer surface, combined with an auxiliary contact member for stable contact, enhancing heat management and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If light emitting diodes are used as light sources in backlight assemblies, then brightness and energy efficiency are improved, but heat generation increases causing defects and reduced lifespan
Solution Approach 1:
The heat releasing member is extracted from the conventional enclosed LED package structure and extended outward through the printed circuit board. This extraction allows the heat-generating portion of the LED to be separated from the internal module environment and exposed to external heat dissipation pathways, thereby resolving the contradiction between maintaining LED energy efficiency and managing the harmful heat it generates.
Solution Approach 2:
The heat releasing member transitions from a conventional planar or enclosed heat dissipation surface to a three-dimensional protruding structure that extends through the printed circuit board. This dimensional change creates additional heat dissipation surfaces and pathways in the vertical dimension, enabling more effective heat management while preserving the LED's energy-efficient light generation function.
2Temperature
If heat releasing members are made to protrude from the module body, then heat dissipation efficiency is improved, but structural complexity increases
Solution Approach 1:
The heat releasing member is merged with the LED chip itself, forming an integrated structure where the light-emitting component and heat-dissipating component are combined in a single element. This merging eliminates the need for separate heat sinks or thermal management components, thereby improving heat dissipation efficiency without significantly increasing overall structural complexity.
Solution Approach 2:
The protruding heat releasing member serves multiple functions: it acts as a thermal conduction pathway from the LED chip, provides an extended heat dissipation surface, and simultaneously serves as a mounting structure that electrically and thermally connects the LED to the printed circuit board. This multi-functionality achieves superior heat dissipation without proportionally increasing structural complexity.
3Reliability
If heat releasing members pass through the printed circuit board, then heat management is improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: first, the heat releasing member is formed and attached to the LED chip; second, the assembled LED module is mounted on the printed circuit board with the heat releasing member extending through a pre-formed hole; third, the protruding portion is contacted with the supporting member. This segmentation allows each manufacturing step to be optimized independently, improving heat management while controlling overall manufacturing complexity.
Solution Approach 2:
The printed circuit board serves as an intermediary structure that facilitates the connection between the LED module and the supporting member. By designing the PCB with pre-formed holes and appropriate contact areas, the manufacturing process is simplified as the board acts as a mediator that automatically provides mechanical support, electrical connection, and thermal pathways, thereby improving heat management without excessively increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat releasing efficiency and durability of the LED module, preventing heat-related defects and extending the lifespan of the display device, while allowing the use of cost-effective general-purpose substrates for increased production yield.
Implementation Method 1
a heat releasing member that is in contact with the light emitting diode chip and protrudes from the body
Data Source
AI summary
A light emitting diode module, a backlight assembly having the light emitting diode module, and a display device having the backlight assembly. The light emitting diode module includes a light emitting device including a light emitting diode chip, a body that surrounds the light emitting diode chip, and a heat releasing member that is in contact with the light emitting diode chip and protrudes from the body. The light emitting diode module also includes a printed circuit board having a hole corresponding to a protruding end portion of the heat releasing member.