Modular DIN Rail Mounting System for Electronic Modules

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Solution Overview

Problem

Existing mounting systems for electronic components in devices like computers are inflexible and do not allow for easy customization or modification by installers to meet specific client needs.

Innovation Solution

A modular mounting system comprising elongate profiles with receiving channels and clamping tongues that enable quick and easy mounting of electronic modules on a carrier, allowing for precise positioning and easy addition or removal of modules, with optional wireless connector elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are fixedly mounted on a PCB, then the mounting system provides stable electrical connections, but the system lacks flexibility and cannot be easily customized or modified by installers

Engineering Contradiction:
Improvecustomization flexibilityVSAvoidmounting system structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The mounting system is divided into separate functional elements: a carrier board with receiving channels, electronic modules with bases, clamping tongues for fixation, and positioning pins for alignment. This segmentation allows installers to selectively assemble and configure modules according to client needs while maintaining stable electrical connections through the modular interface design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The carrier board is designed with universal receiving channels that can accommodate different electronic modules with standardized bases. The clamping tongues and positioning pins provide universal fixation and alignment mechanisms that work across various module types, enabling the system to be customized for different client requirements while maintaining a consistent mounting infrastructure

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of operation

If a modular mounting system with profiles and clamping tongues is used, then the system allows quick and easy mounting and customization of electronic modules, but the device complexity increases compared to fixed PCB mounting

Engineering Contradiction:
Improveinstallation easeVSAvoidmounting system structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The mounting system uses segmented profiles with integrated receiving channels and clamping tongues that can be independently positioned and adjusted on the carrier board. This segmentation enables installers to quickly assemble and reconfigure the mounting structure without complex tools or procedures, while the modular nature actually reduces overall system complexity by allowing selective implementation

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The clamping tongues are designed to automatically engage with and secure the bases of electronic modules when the modules are inserted into the receiving channels. The positioning pins provide self-alignment features that guide modules into correct positions without requiring precise manual positioning, thereby simplifying the installation process and reducing the operational complexity for installers

Inventive Principle:
Principle #25Self-service

Data Source

PatentEP2635100B1Mounting system for electronic modules
Publication Date: 2017.04.19 FIFTHPLAY
  • EP2635100B1 patent drawingFigure 1A~1C
  • EP2635100B1 patent drawingFigure 1B~2
  • EP2635100B1 patent drawingFigure 3

AI summary

Mounting system for mounting an electronic module on a carrier, comprising an electronic module with a plate-like base, and with contacts; a first elongate profile provided with a receiving channel for receiving therein the first side of the base; and a second elongate profile provided with a number of clamping tongues configured to hold the second side of the base; which first and second profiles can be arranged on the carrier such that the or each electronic module can be mounted between the first and the second profile.