Dual PCB Heat Dissipation with Thermal Interface Materials
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Solution Overview
Problem
Electronic devices face challenges in efficiently dissipating heat generated by high-performance components, particularly when using a stacked PCB structure, as heat dissipation efficiency is reduced due to blocked airflow and increased complexity in signal connections, leading to potential overheating and reduced performance.
Innovation Solution
The implementation of a dual-circuit board structure with thermally conductive materials and TIMs (thermal interface materials) to facilitate heat transfer between components, where the first TIM is used between the first electronic component and the heat dissipation device, and the second TIM is used between the second electronic component and the first circuit board, allowing for efficient heat dissipation in opposite directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a stacked PCB structure is used to increase component density, then space utilization is improved, but heat dissipation efficiency deteriorates due to blocked airflow
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments by introducing separate heat dissipation paths for different components. The first heat dissipation path handles heat from components on the first PCB, while the second heat dissipation path handles heat from components on the second PCB, allowing independent heat management in the stacked structure.
Solution Approach 2:
The patent introduces heat dissipation fins as intermediary structures between the PCBs and the surrounding environment. These fins act as mediators that extend the heat dissipation surface area and facilitate heat transfer from the compact stacked PCB structure to the ambient air, overcoming the airflow blockage issue.
2Area of stationary object
If components are arranged in a stacked POP form to increase component density, then space utilization is improved, but heat dissipation efficiency deteriorates due to blocked heat transfer paths
Solution Approach 1:
The patent transitions from a single-plane component arrangement to a three-dimensional stacked structure with independent heat dissipation paths. By creating separate heat dissipation channels in the vertical dimension, the patent allows heat to escape in multiple directions rather than being blocked by overlying components.
3Device complexity
If a single circuit board design is used for signal connections, then device complexity is reduced, but signal connection complexity increases and overall size increases
Solution Approach 1:
The patent segments the signal connection function across multiple PCBs with dedicated connection paths. Each PCB has its own set of signal lines and connection interfaces, which simplifies the design of individual boards while enabling complex functionality through the stacked arrangement. This modular segmentation reduces the complexity of any single board design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, reduces junction temperature, and improves peak performance of electronic components by approximately 6-7% compared to traditional package-on-package structures, while maintaining effective signal routing without overlapping components.
Implementation Method 1
a first heat transfer member comprising a thermally conductive material disposed in an opening formed in the first area of the second circuit board, between the second surface of the second circuit board and the first circuit board and configured to transfer heat from the first electronic component to the heat dissipation device
Implementation Method 2
a second heat transfer member comprising a thermally conductive material disposed between the second electronic component and the first circuit board and configured to transfer heat from the second electronic component to the first circuit board
Implementation Method 3
a heat dissipation device comprising a heat dissipating material disposed on a first surface of the second circuit board
Implementation Method 4
a heat dissipation device comprising a heat dissipating material disposed on a first surface of the second circuit board
Data Source
AI summary
An electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.