Flexible Substrate Heat Dissipation for Semiconductor Light Sources
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Solution Overview
Problem
There is a need for a semiconductor light emitting device with improved heat dissipation characteristics and design flexibility, suitable for mass production, particularly for vehicle light sources that require efficient heat management and adaptable designs.
Innovation Solution
A semiconductor light emitting device with a solder resist layer, conductive layer, and flexible layer made of resin with ceramic or light-reflective filler, featuring heat dissipation structures directly bonded to the flexible layer without additional adhesives, allowing for convex, concave, or bent shapes to enhance heat dissipation and design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal core printed circuit board is used for heat dissipation, then heat dissipation efficiency is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent changes the material parameter of the substrate from traditional metal core PCB to a flexible substrate with phase change material layers, achieving different heat dissipation mechanisms through parameter modification rather than structural complexity
Solution Approach 2:
The patent uses composite materials consisting of flexible substrate, phase change material, and heat dissipation structure, combining the advantages of different materials to achieve both flexibility and heat dissipation efficiency
2Stability of the object's composition
If rigid structures are used for light source mounting, then structural stability is improved, but design freedom and adaptability decrease
Solution Approach 1:
The patent employs a flexible substrate with phase change material that can be bent and shaped into different configurations, providing both structural stability for light source mounting and design freedom for various vehicle light applications
Solution Approach 2:
The flexible substrate allows dynamic adaptation to different mounting positions and configurations, enabling the same structure to serve multiple design requirements without compromising stability
3Strength
If multiple layers and adhesives are used to bond heat dissipation structures, then bonding strength is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges the bonding function and heat dissipation function into a single integrated structure, where the phase change material serves both as adhesive and heat dissipation medium, eliminating the need for separate adhesive layers
Solution Approach 2:
The phase change material automatically provides bonding strength through its phase change properties, eliminating the need for additional bonding processes or separate adhesive materials, thereby simplifying manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high heat dissipation efficiency and design flexibility, achieving 8-10°C lower temperatures compared to traditional metal core printed circuit boards, while simplifying the manufacturing process and enabling mass production.
Implementation Method 1
The flexible layer may be cured to bond the flexible layer and the heat dissipation structure together by pressing the flexible layer and the heat dissipation structure together while applying heat to the flexible layer.
Implementation Method 2
a first heat dissipation structure and a second heat dissipation structure, the first and the second heat dissipation structures being disposed below and in direct contact with the resin of the flexible layer
Data Source
AI summary
There is provided a semiconductor light emitting device including: a heat dissipation structure including one or more of materials among a metal, a ceramic, a semiconductor, and a resin; a flexible insulating layer directly in contact with the heat dissipation structure; a conductive layer laminated on the flexible insulating layer; and a light emitting device mounted on the conductive layer, wherein the light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, and the first electrode includes a plurality of conductive vias connected to the first conductivity-type semiconductor layer through the second conductivity-type semiconductor layer and the active layer.