PCB Conductive Post for Bridge Embedding Matching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing technologies face challenges in achieving high degrees of matching when embedding silicon bridges in substrates due to issues like bridge position deviation, via processing deviation, and pad exposure deviation, which also complicate the assembly process and increase costs.
Innovation Solution
A printed circuit board design that incorporates a conductive post raised on an interconnect bridge, covered with an insulating layer, and featuring a recess portion exposed to the conductive post for forming a conductive pad, which improves matching and reduces manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a silicon bridge is embedded in a substrate, then interconnect functionality is achieved, but matching precision deteriorates due to bridge position deviation, via processing deviation, and pad exposure deviation
Solution Approach 1:
The conductive post is pre-formed on the interconnect bridge before embedding, with its top surface positioned at or above the bridge top surface. This preliminary action establishes a stable reference structure that compensates for subsequent deviations in via processing and pad exposure, thereby improving matching precision without complicating the assembly process
Solution Approach 2:
The conductive post serves as an intermediary structure between the interconnect bridge and the pad. By providing a distinct, pre-formed conductive element with a defined top surface, it mediates the connection process and reduces the impact of positioning deviations, simplifying the overall assembly while improving matching accuracy
2Ease of manufacture
If traditional embedding processes are used, then assembly is simplified, but manufacturing precision deteriorates due to thickness changes in the interconnect bridge
Solution Approach 1:
The conductive post is formed with specific local properties: its material composition, height, and top surface position are locally optimized to be at or above the interconnect bridge top surface. This local quality enhancement at the critical connection point improves manufacturing precision without requiring changes to the overall assembly process
Solution Approach 2:
The conductive post is formed in advance on the interconnect bridge, establishing a stable reference structure before the embedding process. This preliminary action ensures that the top surface position is predetermined, making the assembly process simpler while maintaining consistent bridge thickness
Data Source
AI summary
The present disclosure relates to a printed circuit board, including: an interconnect bridge including an insulating material, a plurality of conductive pattern layers respectively disposed on or in the insulating material, and a conductive post disposed on the insulating material; a first insulating layer embedding the interconnect bridge and having a recess portion exposing a portion of the conductive post; and a first wiring layer disposed on the first insulating layer and including a first pad pattern connected to the exposed portion of the conductive post on the recess portion.