Ringless Vias in Packaging Substrates for Signal Integrity
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Solution Overview
Problem
In electronics packaging, the presence of capture pads or rings in via holes leads to signal reflection and reduced signal transmission performance due to size variations and misalignment, which affects analog signal transmission.
Innovation Solution
A method of forming ringless vias by drilling through all layers of a packaging substrate using a through drill, such as a mechanical or laser drill, without capture pads or rings, and filling the via hole with copper plating to reduce signal reflection and improve signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If capture pads or rings are used in via holes, then via drilling can be facilitated, but signal reflection increases and signal transmission performance deteriorates
Solution Approach 1:
The patent removes the capture pad or ring feature from the via hole structure entirely. By drilling through all layers without these intermediate features, the signal path becomes smoother and reflection is eliminated, while the via still serves its electrical connection function.
Solution Approach 2:
Instead of adding features (capture pads/rings) to facilitate drilling, the patent inverts the approach by removing these features and using a through-drill method that drills through all layers at once, achieving both manufacturing feasibility and signal quality improvement.
2Device complexity
If capture pads or rings are present in via holes, then via formation is simplified, but signal reflection occurs due to size variations and misalignment
Solution Approach 1:
The capture pad or ring features are extracted/removed from the via hole structure. This eliminates the source of size variations and misalignment that cause signal reflection, while the via maintains its electrical connection function through the through-drill method.
Solution Approach 2:
The patent inverts the conventional approach by not adding intermediate features to facilitate drilling, but rather removing them to eliminate signal reflection, using a through-drill method that achieves both goals simultaneously.
3Ease of manufacture
If traditional via drilling methods are used, then manufacturing process is simpler, but signal transmission performance is reduced
Solution Approach 1:
The patent merges the drilling of multiple layers into a single through-drilling operation. By drilling through all layers at once rather than sequentially with intermediate capture pads, the process maintains simplicity while achieving superior signal transmission performance through a smoother, reflection-free path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method eliminates signal reflection and enhances signal transmission performance by providing a smoother signal path without capture pads or rings, improving electrical connectivity in packaged modules.
Implementation Method 1
drilling a via hole through the plurality of layers using a through drill
Implementation Method 2
the through drill includes a laser drill
Implementation Method 3
forming a via in the via hole using a plating process. In some cases, the plating process includes copper plating
Implementation Method 4
the via is configured to reduce signal reflection of analog signals along a path of the via
Data Source
AI summary
According to certain aspects, devices and methods can be provided for forming packaging substrates having ringless vias. For instance, a method of forming one or more vias in a packaging substrate can include: laminating a plurality of layers of a packaging substrate; drilling a via hole through the plurality of layers using a through drill, the plurality of layers not including a capture pad or ring along a path of the through drill for drilling the via hole; and forming a via in the via hole using a plating process.