Circuit Board Module Insulating Adhesive Pads Heat Dissipation

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Solution Overview

Problem

In the manufacturing of small electronic modules, frequent short circuits occur between conductive heat sinks and exposed resistor portions or pads due to the lack of adequate insulation, leading to reliability and heat dissipation efficiency issues.

Innovation Solution

A circuit board module design featuring pads with electrically insulating adhesive portions covering both edges of resistors, along with a heat dissipation member bonded using thermally conductive adhesive, prevents short circuits and enhances heat dissipation by using an insulating layer on the circuit board and selectively forming adhesive portions to cover resistor exposing portions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If adhesive is coated randomly over the board and heat dissipation plate is bonded using the adhesive, then heat dissipation is achieved, but short circuit occurs frequently between conductive heat sink and exposed pads

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcomponent reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The adhesive application is segmented into two distinct types: electrically insulating adhesive portions applied on pads to prevent short circuits, and thermally conductive adhesive portions applied in heat dissipation areas to improve heat transfer. This segmentation resolves the contradiction by allowing simultaneous achievement of electrical isolation and thermal management.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different adhesive properties are applied to different locations: electrically insulating adhesive is used where electrical isolation is needed (on pads), while thermally conductive adhesive is used where heat dissipation is prioritized. This local differentiation allows the system to simultaneously achieve both reliability through insulation and heat dissipation efficiency.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If insulating layer is not applied over portions of resistor pads where resistors are not mounted, then resistor trimming process can be performed, but resistor pads and resistor exposing portions are exposed to atmosphere causing short circuits

Engineering Contradiction:

Improveresistor trimming capabilityVSAvoidcomponent reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

Electrically insulating adhesive portions are applied in advance on the pads before the resistor trimming process. This preliminary insulation ensures that when pads are exposed during trimming, they are already protected from short circuits, thus maintaining both manufacturability and reliability.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If adhesive portions are formed of electrically insulating material on pads, then short circuits are prevented, but heat dissipation efficiency may be reduced

Engineering Contradiction:

Improvecomponent reliabilityVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The adhesive system is segmented into electrically insulating adhesive portions for reliability and thermally conductive adhesive portions for heat dissipation. This segmentation allows each adhesive type to perform its specialized function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adhesive system achieves multi-functionality by combining electrically insulating and thermally conductive properties in different locations. The same adhesive bonding mechanism serves both electrical isolation and thermal management functions through material selection and placement strategy.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively increases component reliability and heat dissipation efficiency by preventing short circuits and utilizing thermally conductive materials for efficient heat management without increasing costs.

Implementation Method 1

adhesive portions provided at least on the pads and formed of an electrically insulating material

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

The adhesive portions may be formed of a thermally conductive material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8330049B2Circuit board module and method of manufacturing the same

Publication Date: 2012.12.11 SEMCNS CO LTD

AI summary

There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased.Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.