PCB Substrate Adhesion via Titanium-Dispersed Conductive Ink
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Solution Overview
Problem
The existing substrates for printed circuit boards require expensive vacuum equipment for sputtering, increasing production costs due to the need for high adhesion strength between conductive layers and base films, which is not efficiently achieved.
Innovation Solution
A substrate with a conductive layer containing titanium in a dispersed manner is formed on a base film using a conductive ink and heating process, eliminating the need for vacuum equipment by suppressing metal diffusion and enhancing adhesion strength without increasing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If sputtering is used to form thin copper layers to improve adhesion strength, then adhesion strength between conductive layer and base film is improved, but production cost increases due to expensive vacuum equipment
Solution Approach 1:
The invention changes the method of forming the conductive layer from physical vapor deposition (sputtering) to a chemical deposition process using a conductive ink containing metal particles and a dispersing agent. This parameter change eliminates the need for vacuum equipment while achieving sufficient adhesion strength through the chemical composition and distribution of metal particles in the ink formulation.
Solution Approach 2:
The invention replaces the mechanical/physical sputtering process with a chemical solution-based process. Instead of using vacuum equipment to deposit metal atoms physically, the invention uses a conductive ink that can be applied and dried to form the conductive layer, substituting a complex mechanical system with a simpler chemical process.
2Strength
If sputtering is used to form thin copper layers, then adhesion strength is improved, but device complexity increases due to vacuum equipment requirements
Solution Approach 1:
The invention replaces the complex vacuum equipment system with a simple solution-based application process. The conductive ink can be applied using conventional coating methods without requiring vacuum chambers, pumps, or specialized deposition equipment, thereby dramatically reducing device complexity.
Solution Approach 2:
The invention uses a disposable conductive ink formulation that can be applied and dried to form the conductive layer. This eliminates the need for expensive, maintenance-intensive vacuum equipment, replacing it with a simple, low-cost, single-use or refillable ink system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides high adhesion strength between the conductive layer and the base film at a lower cost, reducing the likelihood of separation and maintaining conductivity, thus enabling cost-effective production of high-density printed circuit boards.
Implementation Method 1
a step of precipitating metal particles by reducing metal ions, using trivalent titanium ions as a reducing agent, in an aqueous solution
Implementation Method 2
a step of forming a conductive layer by applying the conductive ink to at least one of surfaces of a base film having an insulating property and by heating the conductive ink
Data Source
AI summary
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.