Thermoplastic Polyimide Strain Gauge Adhesive-Free Attachment
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Solution Overview
Problem
The existing strain gauges face inefficiencies in attaching the insulating resin layer to objects like flexure elements and circuit boards, requiring adhesive application and removal steps, which reduces work efficiency.
Innovation Solution
A strain gauge with a flexible resin substrate, a resistor formed on one surface, and a thermoplastic polyimide insulating resin layer that can be easily attached by contact, heating, and pressurization, eliminating the need for adhesives and simplifying the attachment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an adhesive is applied to attach the insulating resin layer to an object, then the attachment can be achieved, but the work efficiency decreases due to additional steps of applying and removing excess adhesive
Solution Approach 1:
The patent extracts the adhesive application step from the attachment process by designing a strain gauge where the insulating resin layer is integrally formed with the substrate. This eliminates the need for separate adhesive application and removal operations, directly resolving the contradiction between reliable attachment and work efficiency.
Solution Approach 2:
The patent merges the insulating resin layer and substrate into a single integral structure. This integration allows the entire strain gauge assembly to be attached as one unit to the object, eliminating the need for separate adhesive application steps and improving work efficiency while maintaining attachment reliability.
2Reliability
If conventional attachment methods are used with adhesives, then the insulating resin layer can be attached to objects, but the attachment process becomes complex and time-consuming
Solution Approach 1:
The patent removes the adhesive from the attachment system entirely, replacing it with a mechanical interference fit and thermal bonding mechanism. This extraction simplifies the attachment process by eliminating the complexity of adhesive application, positioning, and curing operations.
Solution Approach 2:
The patent replaces the chemical bonding mechanism of adhesives with a mechanical and thermal bonding system. The insulating resin layer is heated to a specific temperature range (150-200°C) to activate its bonding properties, creating a direct mechanical-thermal bond with the substrate and object, thereby simplifying the overall attachment process.
3Reliability
If the insulating resin layer is made as a separate component, then it can provide insulation and protection, but it requires additional attachment steps that reduce work efficiency
Solution Approach 1:
The patent combines the insulating resin layer with the substrate into a single integral component. This merging maintains the insulation and protection functions while eliminating the need for separate attachment operations, thereby improving work efficiency without compromising insulation reliability.
Solution Approach 2:
The integrated insulating resin layer serves multiple functions simultaneously: it provides electrical insulation, mechanical protection, and bonding surfaces for attachment. This multi-functionality eliminates the need for separate components and attachment steps, directly improving work efficiency while maintaining all necessary protective functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves work efficiency by allowing for direct and efficient attachment of the insulating resin layer to objects with high bonding strength, reducing the time and complexity of the attachment process compared to conventional methods.
Implementation Method 1
the insulating resin layer is a thermoplastic polyimide layer
Implementation Method 2
attached by contact, heating, and pressurization
Data Source
AI summary
A strain gauge includes a substrate made from resin and having flexibility, a resistor formed on one surface of the substrate, and an insulating resin layer covering the resistor, wherein the insulating resin layer is a thermoplastic polyimide layer.