Parallel Airflow Duct for Compact Image Capture Cooling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing cooling structures in image capturing apparatuses increase the thickness of the apparatus to accommodate air flow passages, leading to a potential decrease in cooling efficiency and an increase in size, which is not efficient for future heat generation demands.

Innovation Solution

The electronic apparatus incorporates a duct arranged substantially parallel to the circuit board, thermally connected to heat sources, and a fan that generates air flows from separate air inlet ports to an air outlet port, effectively cooling the heat sources while maintaining a compact size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If two air flow passages are provided in parallel in the thickness direction to cool heat sources, then cooling coverage is improved, but the thickness of the apparatus body is increased

Engineering Contradiction:
Improvecooling efficiencyVSAvoidthickness of apparatus body
Core Design Contradiction:
TemperatureVSLength of stationary object

Solution Approach 1:

The patent transitions from providing multiple air flow passages in parallel in the thickness direction to arranging a single air flow passage in the plane direction (length direction) of the apparatus body. This dimensional change allows the cooling structure to expand horizontally rather than vertically, maintaining thin profile while achieving adequate cooling coverage through extended passage length and strategic placement of heat dissipation fins at multiple locations along the passage.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If air inlet ports are positioned on opposite sides to create parallel air flows, then cooling coverage is improved, but the directions of air flow passages become substantially the same, reducing cooling effectiveness for multiple heat sources

Engineering Contradiction:
Improvecooling coverageVSAvoidcooling efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent implements local quality by positioning heat dissipation fins at multiple distinct locations along the air flow passage corresponding to different heat source positions. Each fin section provides localized cooling where needed, allowing the single air flow to effectively cool multiple heat sources at different locations rather than requiring parallel flows from opposite sides.

Inventive Principle:
Principle #3Local quality

3Volume of moving object

If the apparatus size is reduced to prevent increase in dimensions, then compactness is improved, but the cooling structure becomes insufficient for future heat generation demands

Engineering Contradiction:
Improveapparatus sizeVSAvoidcooling capacity
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent enhances cooling capacity within a compact volume by making the cooling structure adjustable and adaptable. The air flow passage and heat dissipation fins are designed to be configurable, allowing the cooling performance to be optimized and scaled according to actual heat generation demands without requiring a fixed large-size structure, thus accommodating future increases in heat generation within the same compact form factor.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution efficiently cools the heat sources in the image capturing apparatus without increasing its size, ensuring improved cooling performance even with future increases in heat generation.

Implementation Method 1

a fan, which generates air flows which flow from the first air inlet port and the second air inlet port to the air outlet port, respectively

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

a duct which is arranged substantially parallel to the circuit board and is thermally connected to the at least one heat source

Methodology Applied
Scientific EffectThermal Conduction: Conduction (thermal)

Data Source

PatentUS20250040025A1Electronic apparatus capable of efficiently cooling heat source
Publication Date: 2025.01.30 CANON KK
  • US20250040025A1 patent drawing
  • US20250040025A1 patent drawing
  • US20250040025A1 patent drawing

AI summary

An image capturing apparatus includes an image capturing apparatus body including a first side surface, a second side surface positioned on a side opposite from the first side surface, and a bottom surface substantially orthogonal to the first and second side surfaces, a circuit board, heat sources mounted on the circuit board, and a forced air-cooling unit including a duct arranged substantially parallel to the circuit board and thermally connected to the heat sources, and a fan. First, second, and third openings are formed in the first and second side surfaces, and the bottom surface. The force air-cooling unit includes first and second air inlet ports connected to the first and second openings, and an air outlet port connected to the third opening. The fan generates air flows from the first and second air inlet ports to the air outlet port, respectively.