Over-Molded Busbar Filter for Compact High-Voltage Insulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional busbar filter designs face challenges in achieving sufficient insulation distances, leading to increased product size and production costs as input voltage rises, necessitating a redesign to improve insulation performance and space utilization.
Innovation Solution
The busbar filter incorporates over-molding parts formed between busbars and lead frames, using flexible lead frames instead of traditional PCBs, which enhance insulation and reduce safety distances while optimizing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional PCB and capacitor connection design is used, then insulation distance can be calculated using point-to-point linear distance, but as input voltage increases the required insulation distance increases leading to larger product size and higher production costs
Solution Approach 1:
The patent introduces an over-molding part as an intermediary insulating component between the busbar and capacitor. This mediator provides enhanced electrical insulation with a specified breakdown voltage (e.g., 1500V AC or 3000V DC), allowing reduced clearance distances while maintaining safety standards. The over-molding part acts as a physical barrier that enables more compact design without compromising insulation performance.
Solution Approach 2:
The patent changes the insulation parameter from relying solely on air gap distance to using a solid insulating material with defined electrical properties. By specifying the over-molding part's breakdown voltage and thickness requirements, the design transitions from distance-based insulation to material-based insulation, enabling smaller safety distances while meeting voltage requirements.
2Ease of manufacture
If traditional PCB connection is used, then electrical connection can be established, but space utilization is reduced due to larger required safety distances
Solution Approach 1:
The patent replaces rigid PCB with flexible lead frames that can be bent and shaped to fit compact arrangements. The lead frames provide electrical connection while occupying minimal space, and their flexibility allows optimization of the layout to reduce overall product dimensions while maintaining proper electrical connectivity between components.
Data Source
AI summary
A busbar filter including a core with a through hole, two busbars extending through the through hole, and a first over-molding part formed on the two busbars and between the two busbars and the core, wherein the first over-molding part fills up gaps between the two busbars and a remaining space in the through hole.


