Over-Molded Busbar Filter for Compact High-Voltage Insulation

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Solution Overview

Problem

Traditional busbar filter designs face challenges in achieving sufficient insulation distances, leading to increased product size and production costs as input voltage rises, necessitating a redesign to improve insulation performance and space utilization.

Innovation Solution

The busbar filter incorporates over-molding parts formed between busbars and lead frames, using flexible lead frames instead of traditional PCBs, which enhance insulation and reduce safety distances while optimizing space utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional PCB and capacitor connection design is used, then insulation distance can be calculated using point-to-point linear distance, but as input voltage increases the required insulation distance increases leading to larger product size and higher production costs

Engineering Contradiction:
Improveinsulation performanceVSAvoidproduct size
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent introduces an over-molding part as an intermediary insulating component between the busbar and capacitor. This mediator provides enhanced electrical insulation with a specified breakdown voltage (e.g., 1500V AC or 3000V DC), allowing reduced clearance distances while maintaining safety standards. The over-molding part acts as a physical barrier that enables more compact design without compromising insulation performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the insulation parameter from relying solely on air gap distance to using a solid insulating material with defined electrical properties. By specifying the over-molding part's breakdown voltage and thickness requirements, the design transitions from distance-based insulation to material-based insulation, enabling smaller safety distances while meeting voltage requirements.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If traditional PCB connection is used, then electrical connection can be established, but space utilization is reduced due to larger required safety distances

Engineering Contradiction:
Improveelectrical connectionVSAvoidspace utilization
Core Design Contradiction:
Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The patent replaces rigid PCB with flexible lead frames that can be bent and shaped to fit compact arrangements. The lead frames provide electrical connection while occupying minimal space, and their flexibility allows optimization of the layout to reduce overall product dimensions while maintaining proper electrical connectivity between components.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS20250323614A1Busbar filter
Publication Date: 2025.10.16 CYNTEC
  • US20250323614A1 patent drawing
  • US20250323614A1 patent drawing
  • US20250323614A1 patent drawing

AI summary

A busbar filter including a core with a through hole, two busbars extending through the through hole, and a first over-molding part formed on the two busbars and between the two busbars and the core, wherein the first over-molding part fills up gaps between the two busbars and a remaining space in the through hole.