Multiple-Port Networks TRIZ Cases

By embedding capacitors and inductors in a multilevel package substrate, this case saves die and PCB area for high-speed filtering.

Overlapped non-coupling coil sections cancel current so multiple amplifier outputs combine with lower loss and smaller chip area.

Pivoting planar loops vary inductance without series capacitors, enabling low-loss RF tuning and stable thermal performance.

A switched parallel capacitor in the matching box improves plasma impedance matching while reducing variable-capacitor adjustment stress.

Local EtherCAT master-slave control enables user-configurable RF impedance tuning with lower latency and better plasma process adaptability.

Combining power division, impedance adjustment, and phase-shift filtering lets one RF module handle switching and phase control with fewer parts.

Switched passive elements retune the antenna as battery capacity changes, preserving low-band communication despite shifting ground conditions.

Space-time modulation of varactor-loaded unit cells creates a compact nonmagnetic band-pass filter that passes RF signals in one direction only.

Varying conductive film thickness at opposite ground electrodes improves sputtered shielding uniformity and electrical connection reliability.

By embedding capacitance inside an interconnect pillar, this case cuts die area, lowers interconnect count, and maintains electrical performance.

Offset magnetic-body placement in stacked coils boosts common mode attenuation while keeping differential insertion loss low in a compact filter.

Aligned slot and groove antennas in a foldable phone improve multi-band radiation and transmission efficiency without taking more antenna space.

Bulky lossy RF matching networks are replaced by microstrip-slotline coupling and controllable capacitance to widen impedance tuning and cut reflection.

A PCB transmission-line Balun filter replaces discrete chip parts to shrink RF front-end modules, cut cost, and improve yield.

A reflection circuit with variable resistors and resonance cancels wideband leakage waves without multiple vector adjusters.

A negative impedance circuit cancels plasma impedance for wideband RF matching, improving power transfer and plasma ignition.

Adjustable RF impedance at each substrate support pin reduces PECVD film non-uniformity and mura by matching local conditions to chamber impedance.

A segmented capacitor layout cuts parasitic inductance and common mode noise while preserving insulation resistance in smaller power converters.

By using leakage inductance and shared magnetic sections, one core replaces separate transformer, resonant inductor, and mutual inductor parts.

A nested toroidal filter combines common and differential mode coils with thermal isolation and magnetic encapsulation to boost attenuation and heat control.

Switchable parallel RC filtering adjusts ADC cutoff frequency to match changing BMS noise conditions and improve measurement accuracy.

A divided active EMI filter separates sensing and compensation groups on different substrates to cut size and enable fault detection.

Fractional parallel windings and grounded shield sections cut capacitance and reflections while preserving RF transformer coupling and Q factor.

Multiple low-power filters with impedance matching share amplifier output, shrinking 5G antenna filters while preserving power handling.

Coupled resonators tuned to the same frequency widen the magnetic field, extending charging distance and reducing alignment limits for multiple devices.

A grounded conductive structure with an RLC isolation circuit cuts antenna coupling and return loss in compact 5G and Wi-Fi 6E layouts.

A motorized magnetic body shifts near the transmission coil to offset impedance drift, stabilize resonance, and cut wireless charging loss.

Unequal parallel inductors in a dielectric multilayer stack raise Q value while preserving desired inductance in compact communication components.

Resistive vestigial loads let unused filter circuits stay in place without disturbing active signal paths, cutting array redesign time and cost.

A series fixed and variable inductor circuit enables dynamic phase shift adjustment while maintaining impedance matching.

Variable inductors and switch control tune phase shift by frequency band, reducing frequency dependence in digital phase shift circuits.

A stepped coaxial center conductor and annular dielectric interface reduce field distortion and reflection at the transmission-line boundary.

A stacked electrode capacitor in a multilayer wiring substrate achieves small, precise capacitance while reducing wiring resistance and parasitic effects.

High-pass and low-pass filters separate RF bursts and nanosecond pulses, improving power transfer and reducing plasma chamber interference.

Over-molding fills busbar and core gaps to improve insulation, cut safety distance, and shrink busbar filter size and cost.

A stacked resistor, MOS capacitor, and MOM capacitor layout shrinks filter area while preserving ASK signal integrity under DC offset and drift.

A dual-stage filter splits low- and high-frequency noise suppression in vehicle power conversion, easing resonance while cutting filter size and cost.

Using a nonzero negative coupling factor between inductors, this RF splitter widens bandwidth while improving isolation, insertion loss, and die area.

A diode and DC bias compensation circuit keeps chuck-to-wafer voltage below the damage threshold during high-voltage pulsing.

Adaptive phase, frequency shift, and offset control cuts reflected wave power during pulsed high-frequency supply ON and OFF periods.

Magnetic-particle absorbing film placed between inductors or baluns improves shielding at several tens of GHz while remaining easy to form.

Spiral coupling lines and internal ground overlap improve insertion loss while preserving impedance matching in compact couplers.

A tunable post-resonance circuit uses hybrid resonances and programmable capacitances to deliver precise phase shifts with low loss for beamforming.

Over-molding between busbars and the core improves insulation, cuts safety distance, and shrinks high-voltage busbar filter size.

A three-inductor common-mode choke and added filter stages suppress AC common-mode and differential noise for stable motor power.

Switched fine and coarse EVC banks let software retune plasma impedance quickly, improving RF power transfer and process repeatability.

A diode-array variable capacitor replaces slow motorized vacuum capacitors to tune RF plasma matches in milliseconds and improve process stability.

Passive trunk lines and directional couplers deliver >1 Gbps data for electrochromic window control, sensors, and building monitoring.