Shielded Electronic Component With Asymmetric Ground Film Thickness
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Solution Overview
Problem
The existing electronic components with shielding films on ceramic multilayer substrates face issues of non-uniform film formation due to sputtering direction mismatches, leading to poor electrical connection and reliability, particularly at positions farther from the target.
Innovation Solution
The electronic component design includes an insulating substrate with ground electrodes exposed on opposite sides, covered by conductive films of varying thicknesses, where the conductive film thickness on the electrode closer to the second main surface is thinner than the one closer to the first main surface, ensuring sufficient shielding film thickness and improved electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sputtering is performed with the ceramic multilayer substrate placed such that the surface opposite to the mounting surface faces the target, then the shielding film is formed on the side surfaces, but the shielding film is not uniformly formed on the surfaces of the conductive films because the sputtering direction does not match the desired formation direction
Solution Approach 1:
The patent applies local quality by making the conductive films have different thicknesses at different locations. Specifically, the conductive films on the side surfaces have a first thickness, while the conductive films on the mounting and opposite surfaces have a second thickness that is smaller than the first thickness. This local variation in thickness compensates for the non-uniform sputtering deposition, ensuring adequate shielding film formation across all surfaces.
Solution Approach 2:
The patent changes the parameter of conductive film thickness to resolve the contradiction. By adjusting the thickness distribution of conductive films (thicker on side surfaces, thinner on mounting surfaces), the patent compensates for the non-uniform shielding film deposition caused by sputtering geometry, thereby ensuring both manufacturing precision and electrical connection reliability.
2Reliability
If conductive films are provided on the surfaces of the conductive layers to improve electrical connection, then electrical connection is enhanced, but the shielding film formation becomes non-uniform because the conductive films act as eaves that inhibit sputtering material deposition
Solution Approach 1:
The patent applies local quality by differentiating the thickness of conductive films based on their location. The conductive films on side surfaces have a greater thickness to ensure electrical connection, while the conductive films on mounting surfaces have a smaller thickness to minimize interference with sputtering deposition, thus achieving both electrical connection reliability and shielding film uniformity.
Solution Approach 2:
The patent employs asymmetry by creating an asymmetric thickness distribution of conductive films. The conductive films are thicker on the side surfaces where electrical connection is critical, and thinner on the mounting surfaces where sputtering access is important. This asymmetric design resolves the contradiction between electrical connection and shielding film uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electrical connection and reliability by ensuring uniform shielding film thickness and effective electrical contact between ground electrodes and the shielding film, addressing the non-uniformity issues in existing technologies.
Implementation Method 1
A shielding film on side surfaces of a ceramic multilayer substrate may be formed by sputtering, for example.
Data Source
AI summary
An electronic component includes: an insulating substrate including a first main surface and a second main surface opposite to each other in a thickness direction and a side surface with a plurality of ground electrodes exposed thereto; conductive films each covering a surface of a corresponding one of the plurality of ground electrodes exposed to the side surface of the insulating substrate; and a shielding film covering the first main surface and the side surface of the insulating substrate and surfaces of the conductive films. The plurality of ground electrodes includes a first ground electrode and a second ground electrode, the first ground electrode and the second ground electrode being exposed to the side surface of the insulating substrate at a position closest to the first main surface and at a position closest to the second main surface, respectively.