Multilevel Package Substrate With Integrated Filter to Save Die Area
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Solution Overview
Problem
High speed electronic systems face challenges in integrating low pass filters without increasing die or host printed circuit board area, leading to increased costs and space requirements.
Innovation Solution
A multilevel package substrate with integrated filter circuits, including capacitors and inductors, is used to conserve die area and reduce host printed circuit board space by incorporating filter components within the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If filter circuits are provided on-chip, then filtering functionality is integrated, but the area of the die increases
Solution Approach 1:
The filter circuit is moved from the semiconductor die to the package substrate, utilizing the substrate level as an additional dimension for circuit integration. This allows the filter to be part of the packaged device without occupying precious die area, effectively using the package substrate as a co-processing platform for analog signal conditioning.
2Area of moving object
If off-chip filters are used, then die area is conserved, but the area of the host printed circuit board and cost increase
Solution Approach 1:
The filter circuit is merged with the package substrate, combining what would traditionally be separate components (die and external filter) into a single integrated package. This consolidation eliminates the need for separate off-chip filter components and their associated PCB real estate, while maintaining die area efficiency.
3Area of moving object
If off-chip filters are used, then die area is conserved, but qualification and purchase cost of passive components increases
Solution Approach 1:
The package substrate provides self-service by integrating the filter circuit directly into its structure, eliminating the need to externally source, qualify, and assemble separate passive filter components. The substrate itself becomes the filter implementation platform, reducing supply chain complexity and component costs.
Data Source
AI summary
An electronic device includes a multilevel package substrate, a semiconductor die, and a package structure, the multilevel package substrate having a first level, a second level, and a filter circuit in the first and second levels. The filter circuit includes a filter input terminal, a first capacitor, a first inductor, a second capacitor, a second inductor, a filter output terminal, and a reference terminal. The semiconductor die is attached to the multilevel package substrate and has a conductive structure coupled to one of the terminals of the filter circuit, and the package structure encloses the semiconductor die and a portion of the multilevel package substrate.