Multilayer Wiring Substrate Capacitor Layout for Precise Small Capacitance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional multilayer wiring substrates face challenges in achieving the required capacitance value for LC filters in high-frequency applications due to increased wiring resistance and parasitic capacitance, leading to larger module sizes and reduced performance.
Innovation Solution
A multilayer wiring substrate design featuring a capacitor structure with a lower electrode on the core substrate and an upper electrode with overlapping and extending portions, allowing for a single element to achieve smaller capacitance values with reduced parasitic effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional multilayer wiring substrates are used for high-frequency applications, then the module size can be maintained, but the capacitance precision deteriorates due to increased wiring resistance and parasitic capacitance
Solution Approach 1:
The patent transitions from planar capacitor electrodes to a three-dimensional stacked configuration where upper and lower electrodes are positioned at different vertical levels within the substrate. This vertical dimensionality allows the capacitor to achieve the required capacitance value with smaller electrode areas, thereby reducing the impact of wiring resistance and parasitic capacitance while maintaining compact module size.
Solution Approach 2:
The capacitor structure embeds multiple electrode layers within the substrate thickness, nesting the upper and lower electrodes in a vertical arrangement. This nesting approach concentrates the capacitance-generating structure within the substrate volume rather than spreading it horizontally, reducing the area susceptible to parasitic effects while maintaining the electrical function.
2Volume of stationary object
If the capacitance value is reduced to achieve smaller module size, then the module size decreases, but the capacitance precision deteriorates due to increased parasitic effects
Solution Approach 1:
By utilizing the vertical dimension within the substrate, the patent achieves high capacitance values in a compact horizontal footprint. The stacked electrode configuration allows capacitance to scale with substrate thickness rather than requiring proportionally larger surface areas, thereby maintaining precision while reducing overall module volume.
3Manufacturing precision
If multiple capacitors are connected in series to achieve smaller capacitance values, then the capacitance precision improves, but the device complexity increases
Solution Approach 1:
The patent merges multiple capacitance-generating elements into a single integrated capacitor structure by stacking electrodes vertically. This consolidation achieves the equivalent electrical function of multiple series-connected capacitors while reducing structural complexity, as the stacked configuration provides inherent electrical isolation between electrode pairs without requiring external connection management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables a capacitor with higher precision and improved performance, mountability, and productivity, reducing the module size and enhancing electrical characteristics.
Implementation Method 1
LC filters that utilize electrical resonance using inductors and capacitors
Data Source
AI summary
A multilayer wiring substrate and a module having the multilayer wiring substrate, wherein the multilayer wiring substrate has a capacitor with a capacitance value smaller than that of the conventional one. The substrate includes a core substrate and capacitors installed therein. At least one of the capacitors is a first capacitor which includes a lower electrode, a dielectric layer, and an upper electrode. The lower electrode is located closer to the core substrate than the dielectric layer and the upper electrode are. The upper electrode is located farther away from the core substrate than the dielectric layer and the lower electrode are. The lower electrode is entirely disposed on the core substrate. The upper electrode has a first portion and a second portion. The first portion overlaps the dielectric layer and the lower electrode to serve as the first capacitor. The second portion extends from the first portion.