Over-Molded Busbar Filter for Compact Insulation Spacing
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Solution Overview
Problem
Traditional busbar filter designs face challenges in achieving adequate insulation distances, leading to increased product size and production costs as input voltage rises, necessitating improvements in insulation performance and space utilization.
Innovation Solution
A busbar filter design incorporating over-molding parts between busbars and lead frames, along with flexible lead frames replacing traditional PCBs, enhances insulation performance and reduces safety distances and product size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional PCB and capacitor connection design is used, then insulation distance can be calculated using point-to-point linear distance, but as input voltage increases the required insulation distance increases leading to larger product size
Solution Approach 1:
The patent introduces an intermediary insulating structure between the PCB and capacitor that provides enhanced insulation performance. This intermediary element allows for reduced clearance distances while maintaining adequate insulation, thereby reducing the overall product size without compromising safety or reliability.
Solution Approach 2:
The patent transitions from relying solely on point-to-point linear distance in two dimensions to utilizing three-dimensional spatial arrangement with vertical stacking. By arranging components in multiple layers and utilizing vertical space, the design achieves compactness while maintaining required insulation distances through enhanced insulating structures positioned strategically in 3D space.
2Reliability
If traditional PCBs are used to connect capacitors, then electrical connections can be established, but space utilization is not optimized
Solution Approach 1:
The patent employs flexible lead frames instead of rigid PCBs, allowing the electrical connection structure to adapt dynamically to the spatial arrangement of components. This flexibility enables optimized positioning of capacitors and other components in three-dimensional space, improving space utilization while maintaining reliable electrical connections through the adaptable lead frame structure.
Solution Approach 2:
The patent uses flexible lead frames with thin-film characteristics to establish electrical connections between capacitors and the PCB. These flexible conductive elements can be shaped and positioned to optimize component placement and minimize overall device volume, while still providing reliable electrical connectivity comparable to traditional PCB traces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves reduced safety distances, optimized space utilization, and lower production costs while maintaining electrical performance and compliance with safety standards.
Implementation Method 1
a first over-molding part formed on the two busbars and between the two busbars and the core, wherein the first over-molding part fills up gaps between the two busbars and a remaining space in the through hole
Data Source
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AI summary
A busbar filter including a core with a through hole, two busbars extending through the through hole, and a first over-molding part formed on the two busbars and between the two busbars and the core, wherein the first over-molding part fills up gaps between the two busbars and a remaining space in the through hole.