Integrated Balun Filter Layout for Compact RF Front-End Modules
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Solution Overview
Problem
Existing RF front-end modules with separate Balun and filter designs require large volumes, increased costs, and reduced manufacturing yield due to the use of multiple chip capacitors and inductors, leading to complexity and inefficiency.
Innovation Solution
A Balun filter integrated on a circuit board as a single component, utilizing transmission lines formed by wires and a ground plane, replacing conventional chip components to reduce size and complexity, while maintaining balanced-to-unbalanced and filtering functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Balun and filter are designed separately with multiple chip capacitors and inductors, then the filtering function and balanced-to-unbalanced conversion are achieved, but the module volume increases and manufacturing complexity increases
Solution Approach 1:
The patent combines the Balun and filter into a single integrated component structure. The first and second transmission lines (forming the Balun) and the third transmission line (forming the filter) are integrated on the same circuit board with shared ground connections, eliminating the need for separate chip components and reducing overall module volume.
Solution Approach 2:
The integrated structure performs multiple functions simultaneously: the first and second transmission lines provide balanced-to-unbalanced conversion while the third transmission line provides filtering, and all share common ground plane resources. This multi-functionality in a single structure reduces the number of discrete components needed.
2Reliability
If multiple chip capacitors and inductors are used to form Balun, filter and matching circuit, then the required electrical functions are achieved, but the manufacturing cost increases and manufacturing time increases
Solution Approach 1:
The patent merges multiple discrete chip components (capacitors and inductors) into integrated transmission line structures fabricated directly on the circuit board. This consolidation reduces component count, assembly steps, and manufacturing cost while maintaining the required electrical functions of Balun, filter, and matching circuit.
Solution Approach 2:
The patent replaces mechanical assembly of discrete chip components with a planar transmission line structure fabricated using PCB manufacturing processes. This substitution eliminates the need for separate component mounting, soldering, and assembly operations, reducing manufacturing complexity and cost.
3Reliability
If multiple chip capacitors and inductors are used to form Balun, filter and matching circuit, then the required electrical functions are achieved, but the manufacturing yield rate reduces
Solution Approach 1:
The patent combines multiple discrete components into a single integrated transmission line structure, reducing the number of assembly operations and potential failure points. This integration improves manufacturing yield by eliminating alignment, soldering, and assembly variations associated with multiple discrete chip components.
4Reliability
If Balun and filter are designed separately, then the balanced-to-unbalanced conversion and filtering are achieved, but the design complexity increases
Solution Approach 1:
The patent integrates the Balun and filter designs into a unified transmission line structure where the first, second, and third transmission lines work together as a single system. This integration simplifies the overall design by reducing the number of separate components and their interconnections, while maintaining the required signal processing functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated Balun filter achieves miniaturization, reduces manufacturing costs, and improves yield rates by simplifying the RF front-end module design and maintaining effective signal processing characteristics.
Implementation Method 1
each of the first wire, the second wire and the third wire is coupled to the ground plane and forms a transmission line with the ground plane
Data Source
AI summary
A Balun filter is disposed on a circuit board, and includes a first wire, a second wire, a third wire and a ground plane. The first wire has one end for disposing a first feeding point. The second wire has one end for disposing a second feeding point. The third wire is configured for disposing a third feeding point and includes a first coupling section, a second coupling section, a first central section and a second central section. The third feeding point is located between the first central section and the second central section, and the first coupling section, the first central section, the second central section and the second coupling section are electrically connected in sequence. In a parallel direction of the first wire, the first feeding point and the second feeding point are located in two opposite directions, respectively, relative to the third feeding point.