Embedded Capacitor Pillar for Compact Die Interconnects
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Solution Overview
Problem
State-of-the-art mobile application devices face challenges in achieving a small form factor, low cost, and high electrical performance due to the inclusion of capacitors which increase die size and manufacturing costs, and complex interconnects.
Innovation Solution
A pillar with an embedded capacitor is used to provide both direct current and alternating current paths, reducing the number of electrical interconnects and die size by integrating capacitors within the die and substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are included in the die to improve electrical performance, then capacitance is sufficient, but die area increases significantly
Solution Approach 1:
The patent combines the capacitor structure with the interconnect pillar structure, integrating the capacitor within the pillar that already serves as an electrical interconnect. This merging allows the capacitor to share the same physical space and fabrication processes as the interconnect, eliminating the need for separate capacitor structures and reducing overall die area while maintaining sufficient capacitance for electrical performance
Solution Approach 2:
The interconnect pillar is designed to serve dual functions: as an electrical conductor connecting different circuit layers and as a capacitor structure with conductive plates and dielectric material. This multi-functionality allows the same structure to provide both interconnect functionality and capacitance, reducing the total number of components needed on the die
2Reliability
If capacitors are included in the die to improve electrical performance, then capacitance is sufficient, but manufacturing cost increases
Solution Approach 1:
The capacitor fabrication is merged with the existing interconnect fabrication process, using the same deposition and patterning steps to create both the conductive interconnect plates and the capacitor structure. This integration eliminates additional manufacturing steps and reduces overall fabrication cost while ensuring sufficient capacitance for electrical performance
Solution Approach 2:
The interconnect pillar structure serves itself by incorporating capacitor functionality within the same structure. The conductive plates that form the interconnect also serve as the capacitor electrodes, and the dielectric material between them provides both insulation for the interconnect and the capacitive dielectric, reducing the need for separate capacitor fabrication processes
3Reliability
If capacitors are included in a substrate coupled to the die, then capacitance is provided, but interconnect complexity increases
Solution Approach 1:
The capacitor functionality is extracted from the substrate level and integrated directly into the die-level interconnect structure. By taking the capacitor out of the substrate coupling layer and embedding it within the interconnect pillar on the die, the patent simplifies the substrate interconnect structure and reduces the overall system complexity while maintaining the required capacitance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces die-area and fabrication costs while maintaining high electrical performance by providing multiple conductive paths through a single pillar, thereby minimizing the need for separate capacitors and interconnects.
Implementation Method 1
a dielectric layer disposed between the first conductive structure and the second conductive structure to define the embedded capacitor
Data Source
AI summary
Various aspects of the present disclosure generally relate to wireless communication, and to a pillar that includes one or more structures configured to define a capacitor. For example, a device includes a die, a substrate, and a pillar having an embedded capacitor. The pillar is electrically connected to one or more conductors of the die and to one or more conductors of the substrate. The pillar includes a first conductive structure and a second conductive structure. The pillar also includes a dielectric layer disposed between the first conductive structure and the second conductive structure to define the embedded capacitor.