Bypass Capacitor Structure in Memory Module Cards for Noise Reduction
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Solution Overview
Problem
High-frequency signal transmission in memory module cards, such as DDR SDRAM, is prone to noise interference due to cross-talk, which degrades transmission quality.
Innovation Solution
An electronic module card with a bypass capacitor structure, featuring a main board, adhesive layer, and conduction skirting board, where conductive pads with extending parts form a bypass capacitor to filter out noise interference, and the conduction skirting board reduces the thickness of the module card, allowing for better heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high-frequency signal transmission is implemented in memory module cards, then data transmission rate is improved, but cross-talk noise interference increases
Solution Approach 1:
The patent introduces an intermediary bypass capacitor structure formed between overlapping conductive extending parts to filter out cross-talk noise interference. This intermediary element acts as a mediator between the signal transmission lines, providing a low-impedance path for high-frequency noise to ground while allowing the desired signal to pass through, thus resolving the contradiction between high-speed transmission and noise reduction
Solution Approach 2:
The patent changes the physical parameters of the transmission system by forming a bypass capacitor with specific capacitance values through the overlapping conductive structures. This parameter change enables the system to selectively filter different frequency components, allowing high-frequency signals to transmit while blocking cross-talk noise, thereby resolving the contradiction between transmission rate and noise interference
2Temperature
If the module card thickness is reduced to improve heat dissipation, then heat dissipation efficiency is improved, but structural strength may be compromised
Solution Approach 1:
The patent employs composite material structures in the main board and conduction skirting board, combining different materials with complementary properties. The rigid substrate provides structural strength while integrated heat dissipation pathways and conductive elements facilitate thermal management, allowing thin-profile design without compromising structural integrity
Solution Approach 2:
The patent transitions from two-dimensional planar heat dissipation to three-dimensional heat management by incorporating vertical heat pathways through the conduction skirting board and utilizing the overlapping capacitor structures as thermal conduction paths. This dimensional change enables efficient heat dissipation in a reduced thickness profile while maintaining structural strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bypass capacitor effectively reduces noise interference, enhancing the quality of high-frequency signal transmission and facilitating heat dissipation, thereby improving signal transmission efficiency.
Implementation Method 1
At least one of the conductive pads has a second extending part extending from the adapting part along an inner surface of the rigid substrate, and a part of the second extending part is overlapped above a part of the first extending part, so as to form a bypass capacitor
Data Source
AI summary
An electronic module card with bypass capacitor includes a main board, an adhesive layer and a conduction skirting board. The main board has an inserting section and a plurality of solder pads disposed on a soldering region of the inserting section. At least one solder pad has a first extending part extending therefrom. The conduction skirting board is fixed to the inserting section, and has a rigid substrate and a plurality of conductive pads. Each conductive pad has an outer contacting part, and an adapting part. A gap is formed between the conduction skirting board and the main board. At least one conductive pad has a second extending part extended from the adapting part along an inner surface of the rigid substrate. A part of the second extending part is partially overlapped above a part of the first extending part so as to form a bypass capacitor.