Printed Circuit Assembling TRIZ Cases

Screen printing creates metal bumps on integrated circuit wafers, enabling multi-layer antenna structures that reduce packaging complexity and required space.

An In-Sn-Ag alloy containing specific intermetallic compounds joins electrical components at low temperatures.

Widened portions on transmission lines enable opposite-surface connections while maintaining impedance matching and reducing crosstalk.

A repelling member prevents uncured thermosetting resin from flowing away during PCB manufacturing.

Segmented contact structures enable parallel processing to eliminate serial ball bonding delays while maintaining mechanical stability and thermal conductivity.

Heating pure metal above impurity boiling points reduces alpha dose while preserving sphericity for high-density mounting.

A dielectric sheet fills gaps around embedded components in thinner cores to balance height differences and reduce warpage.

Printed copper mesh electrodes replace fragile ITO films to improve durability while maintaining 98% optical clarity.

A method fixes a coupling lens to a frame and adjusts the light source position relative to the lens while emitting light.

A magnetic flux concentrator amplifies the field at a Hall sensor active area using a trapezoidal permeable structure.

Variable spacing between adjacent pads compensates for thermal expansion mismatch, preventing misalignment and improving bonding yield.

A heat curable resin composition removes trapped voids through controlled epoxy reaction ratios and vacuum heating.

A Sn-Ag-Cu solder alloy incorporating 0.1 to 0.5 mass % of calcium or manganese additives.

Ion implantation creates microcavities in piezoelectric single crystals for controlled thin film separation.

A multilayered ceramic capacitor uses segmented external electrodes with non-conductive layers to confine solder fillets during reflow mounting.

A module mount interposer mechanically and electrically couples communication modules to printed circuit boards using integrated fastener receivers.

Segmenting the backplane into detachable bonding areas allows switching to a secondary connection point when defects occur, reducing scrapping costs.

Segmented lead lines extend in crossing directions on a base substrate, reducing the horizontal footprint of data lines and shrinking the light-blocking area.

A conduction skirting board with extending parts creates a bypass capacitor that filters cross-talk noise while reducing module thickness.

Curved encapsulation surfaces prevent deformation and stray light interference in camera module manufacturing.

A high frequency module power amplifier uses varied terminal heights and substrate protrusions to ensure proper alignment during mounting.

Data transmission contacts feature adjustable height sections to accommodate variable vertical positions across circuit board interfaces.

Simultaneous thermo-compression and ultraviolet irradiation cure a composite adhesive film, filling vertex portions while minimizing overflow beyond chip sides.

A solder alloy with specific Sb and In content enhances tensile strength at high temperatures.

Curable masking material fills RF switch receptacles to form elastic plugs, preventing coating ingress while maintaining probe access for re-work cycles.

Integrated carrier plates reduce tolerance chains by aligning reflectors via measured light source references.

A board printing apparatus uses two separate printing tables to deposit viscous material for small and large components sequentially.

Magnetic field alignment segments ferromagnetic particles into isolated conductive paths, preventing electrical shorting between contacts spaced below 250 μm.

Frame substrates isolate electric fields to allow electronic components near solder lands, mitigating pyroelectric voltage during reflow.

An elastic mounting head deforms to match semiconductor chip warpage, distributing pressing force evenly across terminals to prevent junction failures.

A component mounting apparatus coordinates parallel board transfer devices to mount components during loading and unloading cycles.

A chip package uses a redistribution layer to form a T-contact electrical connection on a thin substrate.

A thermoplastic frame surrounds conductive contacts, preventing air pockets and plastic residue contamination during duroplast molding.

Channeled profile stripline conductors mitigate the skin effect and signal loss into dielectric material, enabling reliable transmission beyond 10 GHz.

Ring bodies in substrate openings constrain solder expansion, preventing mask cracking from CTE mismatch.

A hot melt adhesive composition blends block copolymers with semi-crystalline polyolefins to withstand 260°C heating.

Slots enable fixing elements to move parallel to the board, distributing assembly stress to prevent solder cracks while maintaining waterproof sealing.

A submount bar method bonds laser diodes using localized solder melting and pressing loads to secure components.

A component supply device counts electronic components on a transport path to identify stick case changes.

A flexible circuit board cut portion overlaps a dummy pad to reduce stretch dispersion during compression.

A solderless surface mount fuse design eliminates internal soldering to reduce manufacturing complexity and electrical resistance.

Laser ablation cleans and roughens printed circuit boards, resolving weak bonding risks in fiber optic assemblies.

Merging DC blocking capacitors with solder ball interconnects reduces PCB area consumption and signal path discontinuities for high-speed serial links.

Pre-filling and sealing the heat pipe before embedding prevents internal pressure build-up and physical deformation during high-temperature lamination.

A plated standoff on a circuit board pad defines solder joint thickness during reflow, reducing voids and improving mechanical strength.

Segmented grooves prevent bonding agent adhesion to distorted regions, resolving vibration noise and connection failures during voltage variations.

Eliminating equipotential boards via direct soldering simplifies display device manufacturing and cuts costs.

Patterned regrowth synthesizes lateral heterojunctions with controlled bandgaps, solving lithography damage to atomic structure.

Replacing laser drilling with mechanical punching to create smooth via walls, eliminating roughness and tapering that degrade electrical contact quality.