Piezoelectric Transformer Mounting on Double-Sided PCB
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Solution Overview
Problem
Existing piezoelectric transformers mounted on double-sided printing substrates face challenges in high-density component integration due to electric field interference, limiting the use of second surfaces for electronic components.
Innovation Solution
A surface-mounted piezoelectric transformer design with a frame substrate supporting the piezoelectric substance, allowing for a projection region on the second mounting surface where electronic components can be mounted without interference, and using resistors to mitigate pyroelectric voltage effects during reflow soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a piezoelectric transformer is surface-mounted to the first surface of a double-sided printing substrate, then the transformer can be effectively mounted, but electronic components cannot be mounted near the land on the second surface where pins are soldered due to electric field interference
Solution Approach 1:
The second surface of the printing substrate is divided into a mounting prohibited region (near the land where pins are soldered) and a mounting allowed region (away from the land). This segmentation allows electronic components to be mounted in safe areas while avoiding electric field interference zones, thus resolving the contradiction between mounting reliability and component integration density.
2Reliability
If the entire projection region of the piezoelectric substance is designated as a mounting prohibited region, then electric field interference is avoided, but the usable area for mounting electronic components is reduced
Solution Approach 1:
Different regions of the second surface are assigned different qualities: the area near the land is designated as a mounting prohibited region to ensure electronic component performance, while the area away from the land is designated as a mounting allowed region to maximize usable mounting area. This local differentiation resolves the contradiction between reliability and mounting area.
3Reliability
If resistors are added to mitigate pyroelectric voltage effects during reflow soldering, then semiconductor components are protected from pyroelectric voltage, but device complexity increases
Solution Approach 1:
Resistors are introduced as intermediary elements connected between the pins and the printing substrate. These resistors act as mediators that suppress pyroelectric voltage during reflow soldering, thereby protecting semiconductor components. The resistors are simple passive components that minimize the increase in device complexity while achieving the protection function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-density integration of electronic components on both surfaces of the printed circuit board without performance degradation and protects semiconductor components from pyroelectric voltage, improving circuit miniaturization and reliability.
Implementation Method 1
a piezoelectric transformer having a piezoelectric substance (100)
Implementation Method 2
mitigate pyroelectric voltage effects during reflow soldering
Data Source
AI summary
A printed circuit board comprises a first mounting surface, a second mounting surface, and a piezoelectric transformer. The piezoelectric transformer has a piezoelectric substance, external electrodes, and a frame substrate. The second mounting surface has a projection region. There is a first region from a first location, where an end portion further from the output electrode out of end portions of the input electrode is projected onto the second mounting surface in the projection region, to a second location, where an end portion closer to the output electrode out of the end portions of the input electrode is projected onto the second mounting surface, the first region being a mounting allowed region where an electronic component is mounted.