OLED Backplane Detachable Bonding Areas for Repair
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high scrapping cost of OLED display devices due to defective bonding processes, where poor bonding leads to damaged metal terminals and subsequent product rejection, is a significant issue in the manufacturing of OLED backplanes.
Innovation Solution
Incorporating a backplane design with a detachable first bonding area and a second bonding area, allowing for interchangeable bonding with external electronic components, thereby enabling repair and reducing scrapping costs when the first bonding area is defective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single bonding area is provided on the backplane, then the device complexity is reduced, but the scrapping cost increases when bonding defects occur
Solution Approach 1:
The bonding area on the backplane is segmented into multiple independent bonding areas (first bonding area and second bonding area). When a bonding defect occurs in one area, the system can switch to another bonding area to complete the connection, thereby reducing scrapping costs while maintaining overall system reliability.
2Reliability
If multiple bonding areas are provided on the backplane, then the scrapping cost is reduced when bonding defects occur, but the device complexity increases
Solution Approach 1:
The system incorporates dynamic switching capability between multiple bonding areas. The bonding connection can be dynamically adjusted from the first bonding area to the second bonding area when defects are detected, allowing the system to adapt to bonding failures without requiring complete redesign of the bonding structure.
3Ease of manufacture
If the first bonding area is used for bonding, then the manufacturing process is simplified, but the product must be scrapped when the first bonding area is defective
Solution Approach 1:
The backplane is pre-configured with multiple bonding areas before the bonding process. When a defect is detected in the first bonding area during manufacturing, the system can immediately switch to the second bonding area without requiring product rejection, thereby reducing material loss while maintaining manufacturing simplicity.
Data Source
AI summary
Provided are a backplane and a display device. The backplane comprises an active area, a first binding area and a second binding area. The first binding area is detachably disposed on a side of the second binding area away from the active area, and both the first binding area and the second binding area are capable of being bonded to an external electronic assembly. By arranging two binding areas, if there is a defective product in a module process, the first binding area is detached, and the second binding area is attached to the external electronic assembly, such that the display device is repaired in the module process, thereby reducing a scrapping cost of the product.