High Frequency Module Power Amplifier Terminal Height Compensation
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Solution Overview
Problem
High frequency modules with power amplifiers face mounting failures due to insufficient connection between external terminals of different heights, leading to heat dissipation issues and reliability concerns.
Innovation Solution
The module design includes external and land electrodes with varying distances and shapes to ensure proper alignment and increased heat dissipation, with the second external terminal having a larger area and rectangular shape, and the first external terminal having a circular shape, while the land electrodes are formed with different heights to compensate for the terminal differences, using ultraviolet or light curable materials for precise formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cross-sectional area of the external terminal where heat is likely to be generated is made larger, then heat dissipation capability is improved, but the height of the external terminal becomes higher than other external terminals
Solution Approach 1:
The patent applies local quality by making different external terminals have different cross-sectional areas based on their specific functional requirements. The first external terminal (connected to the amplifying element) has a larger cross-sectional area to improve heat dissipation, while other terminals have smaller cross-sectional areas. This localized differentiation resolves the contradiction by optimizing heat dissipation only where needed rather than uniformly increasing all terminal dimensions.
Solution Approach 2:
The patent introduces a height compensation mechanism by making the connection surface of the substrate protrude in the height direction. This creates a new dimensional solution where the substrate's connection surface height compensates for the height difference between external terminals of different cross-sectional areas, allowing larger terminals to have better heat dissipation without causing mounting alignment failures.
2Temperature
If external terminals of different heights are formed in the power amplifier, then heat dissipation is improved, but the connection between the external terminal with lower height and the land electrode becomes insufficient
Solution Approach 1:
The patent introduces a height compensation mechanism by making the connection surface of the substrate protrude in the height direction. This creates a new dimensional solution where the substrate's connection surface height compensates for the height difference between external terminals of different cross-sectional areas, allowing larger terminals to have better heat dissipation without causing mounting alignment failures.
Solution Approach 2:
The height compensation structure is built into the substrate before mounting the power amplifier. By pre-forming the protruding connection surface on the substrate, the patent ensures that height differences are compensated in advance, preventing connection reliability issues before they occur during the mounting process.
3Temperature
If the cross-sectional area of external terminals is increased for heat dissipation, then heat dissipation capability is improved, but mounting failure occurs due to height differences
Solution Approach 1:
The patent introduces a height compensation mechanism by making the connection surface of the substrate protrude in the height direction. This creates a new dimensional solution where the substrate's connection surface height compensates for the height difference between external terminals of different cross-sectional areas, allowing larger terminals to have better heat dissipation without causing mounting alignment failures.
Solution Approach 2:
The patent changes the height parameter of the substrate's connection surface to compensate for variations in external terminal heights. By adjusting this parameter, the patent maintains consistent mounting precision across terminals with different cross-sectional areas, resolving the contradiction between heat dissipation optimization and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses mounting failures and enhances heat dissipation capabilities, improving the reliability and efficiency of the high frequency module by optimizing the connection and heat management between the power amplifier and substrate.
Implementation Method 1
using ultraviolet or light curable materials for precise formation
Data Source
AI summary
A high frequency module includes a power amplifier and a substrate on which the power amplifier is mounted. The power amplifier includes a first external terminal and a second external terminal formed on a mounting surface. The substrate includes a first land electrode and a second land electrode formed on one principal surface. The first external terminal is connected to the first land electrode, and the second external terminal is connected to the second land electrode. A distance from the mounting surface to a connection surface of the first external terminal is shorter than a distance from the mounting surface to a connection surface of the second external terminal, and a distance from a connection surface of the first land electrode to the one principal surface is longer than a distance from a connection surface of the second land electrode to the one principal surface.