Interposer Grooves Reduce Capacitor Bonding Adhesion
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Solution Overview
Problem
Current mounting methods for multilayer ceramic capacitors on circuit boards face challenges with mechanical distortion due to voltage variations, leading to vibration and audible noise, and are difficult to adapt to high-density mounting requirements.
Innovation Solution
An electronic component configuration featuring a substrate with specific electrode arrangements and grooves that reduce the adhesion of bonding agents to areas of distortion, allowing for easier structural design and mounting while maintaining electrical and mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is used to prevent vibration sound, then vibration noise is reduced, but land pattern changes are required which are difficult to achieve for high-density mounting circuit boards
Solution Approach 1:
The patent segments the bonding interface by introducing grooves that divide the bonding agent application area into multiple regions. This segmentation allows the bonding agent to be confined to specific areas away from the capacitor body, preventing vibration noise transmission to the circuit board while maintaining the simple direct-mounting structure without requiring land pattern changes.
Solution Approach 2:
The patent applies local quality by creating grooves at specific locations on the mounting land to control bonding agent distribution. The grooves are positioned to create bonding agent-free zones directly beneath the capacitor body, locally modifying the bonding characteristics only where needed to prevent vibration noise while maintaining bonding strength in other areas.
2Strength
If bonding agent is applied generously to ensure strong mounting, then mounting strength is improved, but bonding agent adhesion to distorted regions increases causing connection failures
Solution Approach 1:
The patent extracts the bonding agent from regions that would come into contact with the capacitor body during voltage-induced distortion. By removing bonding agent from these critical areas through the groove structure, the patent prevents connection failures while maintaining sufficient bonding strength in the remaining bonding regions.
Solution Approach 2:
The patent applies preliminary anti-action by pre-configuring grooves that prevent bonding agent from reaching distorted regions before voltage variation occurs. This proactive措施 ensures that even when the capacitor distends due to voltage changes, the bonding agent is already positioned in safe zones away from potential contact points, preventing connection failures.
Data Source
AI summary
An electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other. Two first mounting electrodes and two second mounting electrodes are located on the front surface of the substrate, on opposite end portions in the longitudinal direction. Recesses are located in the longitudinal side surface of the insulating substrate. Connecting conductors are each provided in the side wall surface of each of the recesses. The connecting conductors connect a first external connection electrode and a second external connection electrode that are located on the back surface of the substrate, and first mounting electrodes and second mounting electrodes.