Multilayered Ceramic Capacitor Electrode Segmentation
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Solution Overview
Problem
Multilayered ceramic capacitors with low adhesion strength and increased acoustic noise due to solder overflow during mounting on printed circuit boards, which also lead to increased mounting area and vibration transfer.
Innovation Solution
A multilayered ceramic electronic component with non-conductive layers on external electrodes and an insulating layer covering internal electrodes, reducing solder overflow and acoustic noise by limiting solder fillet thickness and area, while maintaining high capacitance and low equivalent series inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a relatively large amount of solder fillet is used to solve adhesion strength problems and prevent bending, then adhesion strength is improved, but mounting area increases and acoustic noise increases due to solder overflow
Solution Approach 1:
The patent divides the external electrode structure into multiple functional layers: a base external electrode layer for electrical connection, and a separate non-conductive layer (such as resin or ceramic) covering the upper portion of the external electrode. This segmentation allows the solder fillet to be confined to specific areas, preventing overflow while maintaining adequate adhesion strength without requiring excessive solder material.
Solution Approach 2:
The non-conductive layer acts as an intermediary barrier between the external electrode and the solder fillet. This intermediate structure prevents solder from overflowing onto the upper portion of the external electrode during the reflow process, thereby reducing the required mounting area while still allowing sufficient solder to provide adequate adhesion strength at the bonding interface.
2Strength
If a relatively large amount of solder fillet is used to prevent bending and improve adhesion, then adhesion strength is improved, but acoustic noise increases due to vibration transfer
Solution Approach 1:
By segmenting the external electrode structure with a non-conductive layer, the patent confines the solder fillet to specific bonding areas. This reduces the overall volume of solder that can vibrate and transfer vibrations to the printed circuit board, thereby reducing acoustic noise while maintaining adequate adhesion strength at the critical bonding interfaces.
Solution Approach 2:
The non-conductive layer serves as a vibration-damping intermediary that reduces the transmission of vibrations from the solder fillet to the external electrode and subsequently to the printed circuit board. This intermediate structure decreases acoustic noise generation while still allowing the solder to provide necessary adhesion strength.
3Volume of moving object
If thicknesses of dielectric layers and internal electrodes are reduced to achieve subminiature size, then compactness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the structural parameters of the external electrode system by introducing a non-conductive layer with specific thickness and material properties. This allows for compensation of dimensional variations in the reduced-thickness dielectric layers and internal electrodes, maintaining electrical performance and mechanical stability despite the miniaturized dimensions and tighter manufacturing tolerances.
4Productivity
If all external electrodes are positioned on a lower surface to improve mounting density and reduce ESL, then mounting density is improved, but adhesion strength decreases and bending occurs
Solution Approach 1:
The patent segments the external electrode configuration by positioning some electrodes on the lower surface (for high mounting density and low ESL) while extending other electrodes to side surfaces. The non-conductive layer is strategically placed to provide reinforcement and adhesion support at critical locations, compensating for the reduced adhesion strength inherent in the lower-surface-only configuration.
Solution Approach 2:
The patent uses composite material structures, combining conductive materials for electrodes with non-conductive materials (resins, ceramics) for structural support and adhesion enhancement. This composite approach allows the capacitor to achieve both high mounting density through lower-surface electrode positioning and adequate adhesion strength through the reinforcing non-conductive structures.
Data Source
AI summary
There is provided a multilayered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second side surfaces; first and second internal electrodes having an overlapping region provided in the ceramic body, forming a capacitance forming area exposed to the first side surface, the first internal electrode having a first lead-out portion, and the second internal electrode being insulated from the first internal electrode and having a second lead-out portion; a first external electrode connected to the first lead-out portion and a second external electrode connected to the second lead-out portion; and an insulating layer formed on the first side surface, wherein the first and second external electrodes further include non-conductive layers formed on outer surfaces thereof.