Laser-Roughened PCB Surface for Fiber Optic Bonding

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Solution Overview

Problem

Printed circuit boards (PCBs) with smooth surfaces pose challenges in attaching optical components due to contamination and lack of surface roughness, leading to weak bonds that can break during manufacturing or operation, especially in optoelectronic assemblies for fiber optic communications.

Innovation Solution

The surface of PCBs is modified using a laser to remove contaminants and increase roughness, creating a laser-roughened area for improved bonding with optical components, which enhances the strength and durability of the bond between the PCB and attached components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the PCB surface is left smooth and uncontaminated, then the manufacturing process is simpler, but the bonding strength between optical components and PCB is insufficient

Engineering Contradiction:

Improvebonding strengthVSAvoidsurface preparation complexity

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent applies preliminary surface treatment (cleaning and roughening) to the PCB before optical component attachment. This pre-processing creates an optimized surface structure that enhances bonding strength, resolving the contradiction between simple manufacturing and strong bonding by performing necessary preparations in advance.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies surface roughening specifically to the bonding area where optical components will be attached, rather than treating the entire PCB surface. This localized treatment improves bonding strength at the critical interface while minimizing additional manufacturing complexity.

Inventive Principle:

Principle #3Local quality

2Strength

If the PCB surface is roughened to improve bonding, then the bond strength increases, but the surface contamination risk increases

Engineering Contradiction:

Improvebond strengthVSAvoidsurface contamination

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent performs cleaning before roughening to remove contaminants prior to surface modification. This sequential approach ensures that contaminants are removed before the roughening process, preventing contamination from being trapped in the roughened surface structure.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent extracts (removes) contaminants from the PCB surface through cleaning processes before applying the roughening treatment. This extraction of harmful contaminants before surface modification prevents them from interfering with the bonding process.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If laser treatment is applied to clean and roughen the PCB surface, then bonding reliability improves, but the manufacturing process complexity increases

Engineering Contradiction:

Improvebonding reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines cleaning and roughening operations into a single integrated laser treatment process. This merging of multiple surface preparation steps into one process reduces manufacturing complexity while achieving both contamination removal and surface roughening for improved bonding reliability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces traditional mechanical cleaning and roughening methods with laser treatment. This substitution eliminates the need for separate mechanical processing steps, reducing process complexity while improving bonding reliability through precise control of the laser parameters.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laser treatment improves the bonding process by removing contaminants and increasing surface roughness, reducing the likelihood of bond failure during manufacturing and operation, and facilitates easier detection of cleaned and roughened areas, thus enhancing the reliability of optoelectronic assemblies.

Implementation Method 1

The surface of PCBs is modified using a laser to remove contaminants

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

increase roughness, creating a laser-roughened area for improved bonding

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS11555973B2Fiber optics printed circuit board assembly surface cleaning and roughening

Publication Date: 2023.01.17 II VI DELAWARE INC

AI summary

The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.