Patterned Regrowth for Graphene-hBN Heterojunctions

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Solution Overview

Problem

Current methods for producing thin films lack precise spatial control over electrical properties, particularly in two-dimensional systems like graphene/h-BN interfaces, which are essential for advanced integrated circuitry, as they are not compatible with conventional lithography and often damage the atomic structure.

Innovation Solution

A method called 'patterned regrowth' is used to create continuous thin films by growing two materials, such as graphene and hexagonal boron nitride, where the first material is patterned using photolithography and reactive ion etching, allowing for precise control over the arrangement of atoms and formation of lateral heterojunctions, enabling control over electrical properties and integration with lithography.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional lithography-compatible methods are used to control atom arrangement in thin films, then integration with lithography is achieved, but precise spatial control over electrical properties at interfaces is lost

Engineering Contradiction:
Improveintegration with lithographyVSAvoidspatial control over electrical properties
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The thin film is segmented into distinct regions with different materials (graphene and h-BN) arranged in specific spatial patterns. This segmentation allows different areas to have different electrical properties while maintaining overall film continuity and enabling precise control through the patterned heterostructure design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the thin film are assigned different material compositions and electrical properties. The graphene regions provide high electrical conductivity while h-BN regions provide insulation, allowing local control of electrical properties to be integrated with lithography processes

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If methods are used to control atom arrangement in thin films, then electrical properties can be controlled, but damage to the atomic structure occurs

Engineering Contradiction:
Improvecontrol over atom arrangementVSAvoiddamage to atomic structure
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The thin film structure self-heals and maintains atomic integrity through the patterned regrowth process. The controlled interfaces between materials are formed in a way that prevents atomic structure damage, allowing precise atom arrangement control without compromising structural integrity

Inventive Principle:
Principle #25Self-service

3Manufacturing precision

If methods are used to control atom arrangement in two-dimensional films, then electrical properties are controllable, but compatibility with two-dimensional film structure is lost

Engineering Contradiction:
Improvecontrol over atom arrangementVSAvoidcompatibility with two-dimensional film
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The invention transitions from controlling atoms in three-dimensional bulk materials to controlling atom arrangement in two-dimensional thin films. The patterned heterostructure approach is specifically designed for 2D materials, maintaining compatibility with the two-dimensional film structure while enabling precise spatial control of electrical properties

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in mechanically and electrically continuous films with controlled bandgaps, maintaining high carrier mobilities and low sheet resistances, facilitating the development of atomically thin integrated circuitry and enabling the fabrication of complex devices with precise electrical isolation.

Implementation Method 1

Although recent advancements in chemical vapor deposition (CVD) methods have allowed the large scale production of both intrinsic and doped graphene, as well as hexagonal boron nitride (h-BN)

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Implementation Method 2

Selected regions of the first film are removed to form a patterned film. Portions of the first film material may be removed, for example, using photolithography

Methodology Applied
Scientific EffectPhotolithography: Photography

Implementation Method 3

Portions of the first film material may be removed, for example, using photolithography and reactive ion etch

Methodology Applied
Scientific EffectReactive ion etch: Plasma

Data Source

PatentUS9947749B2Thin film compositions and methods
Publication Date: 2018.04.17 CORNELL UNIV CORNELL CENT FOR TECH ENTERPRISE & COMMLIZATION CCTEC
  • US9947749B2 patent drawing
  • US9947749B2 patent drawing
  • US9947749B2 patent drawing

AI summary

Certain embodiments of the present invention include a versatile and scalable process, “patterned regrowth,” that allows for the spatially controlled synthesis of lateral junctions between electrically conductive graphene and insulating h-BN, as well as between intrinsic and substitutionally doped graphene. The resulting films form mechanically continuous sheets across these heterojunctions. These embodiments represent an element of developing atomically thin integrated circuitry and enable the fabrication of electrically isolated active and passive elements embedded in continuous, one atom thick sheets, which may be manipulated and stacked to form complex devices at the ultimate thickness limit.