Dielectric Sheet Embedding for Thinner PCB Cores
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Solution Overview
Problem
Conventional PCBs with embedded electronic components tend to bend or warp due to limitations in packaging solutions, which restrict flexibility in board design and increase costs, especially when dealing with components of varying heights.
Innovation Solution
A component carrier is manufactured using a dielectric sheet to balance height differences between the core and electronic components, allowing for reliable embedding of components with heights exceeding the core, while reducing warpage through additional dielectric layer lamination and matching thermal expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are embedded in conventional PCBs using adhesive or manual methods, then components can be attached before lamination, but the PCBs tend to bend and warp, reducing design flexibility and increasing costs
Solution Approach 1:
The patent changes the physical state of the dielectric material from solid pre-preg to liquid composition, which is then cured to form solid dielectric layers. This parameter change allows the dielectric to flow and conform to height differences between components and PCB, eliminating warpage while maintaining embedding stability
Solution Approach 2:
The patent uses composite dielectric structures consisting of multiple dielectric layers (first dielectric layer, second dielectric layer) with different properties. The first dielectric layer fills gaps around components, while the second dielectric layer provides planarization, creating a composite material system that resolves the contradiction between embedding stability and warpage reduction
2Adaptability or versatility
If electronic components with varying heights are embedded in PCBs, then design flexibility is limited, but maintaining consistent component heights reduces adaptability
Solution Approach 1:
The patent applies local quality by having the first dielectric layer specifically fill gaps around individual components with varying heights, while the second dielectric layer provides a uniform planar surface. This localized approach allows different regions to have different properties, enabling adaptability to varying component heights while maintaining manufacturing precision for the final surface
3Ease of manufacture
If adhesive is used to attach electronic components before lamination, then components are secured in position, but adhesive residues remain on components, requiring additional cleaning steps
Solution Approach 1:
The patent extracts the adhesive function from the manufacturing process by replacing traditional adhesive attachment with direct embedding in curable dielectric composition. The dielectric material cures in place, securing components without leaving residues, thereby eliminating the need for additional cleaning steps while maintaining ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables flexible and stable embedding of electronic components with high registration accuracy, reducing warpage and thermal stress, and maintaining mechanical stability over time.
Implementation Method 1
covering core and electronic component(s) with a dielectric sheet which has turned out to be capable of balancing or equilibrating height differences
Implementation Method 2
matching thermal expansion coefficients
Data Source
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AI summary
A component carrier (400), comprising a core (100) having a recess (102), at least one electronic component (306) arranged in the recess (102), wherein a vertical thickness (D) of the at least one electronic component (306) is larger than a vertical thickness (d) of the core (100), and an electrically insulating sheet (402) covering at least part of a top main surface (110) of the core (100), covering at least part of the at least one electronic component (306) and filling a gap between a lateral surface (300) of the at least one electronic component (306) and a lateral surface (104) of the core (100) in the recess (102).