Semiconductor Mounting Head with Elastic Body for Warpage Compensation
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Solution Overview
Problem
The existing semiconductor mounting processes face challenges in applying even pressure to laminated semiconductor chips due to thickness variations and warpage, which can lead to failures in terminal junctions, especially as chip size increases, resulting in inconsistent terminal alignment and potential physical disruption.
Innovation Solution
A semiconductor mounting apparatus with a head that includes a diaphragm and an elastic body, which deforms to match the shape of the semiconductor chip, allowing for close contact and even pressure application, ensuring parallel alignment of terminals and effective joining across the chip surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a rigid head structure is used to pressurize semiconductor chips, then the pressing force is strong enough to ensure terminal junction, but the pressure cannot be evenly distributed due to thickness variations and warpage
Solution Approach 1:
The head incorporates an elastic body that can elastically deform to adapt to thickness variations and warpage of semiconductor chips. This flexible structure allows the pressing force to be evenly distributed across the chip surface, ensuring uniform pressure application while maintaining sufficient total force for reliable terminal junction.
Solution Approach 2:
The elastic body changes its physical state from a rigid form to a deformable form under compression, allowing it to conform to the irregular surfaces of chips with varying thickness and warpage. This parameter change enables the system to maintain both high pressing force and even pressure distribution simultaneously.
2Manufacturing precision
If the head structure is made flexible to adapt to chip variations, then even pressure can be applied, but the structural strength may be insufficient for reliable joining
Solution Approach 1:
The head uses a composite structure combining an elastic body with a supporting unit. The elastic body provides flexibility for even pressure distribution, while the supporting unit provides the necessary structural strength. This composite design allows the system to simultaneously achieve uniform pressure application and maintain sufficient joining strength for reliable terminal connections.
3Productivity
If chip size is increased to enhance performance, then more terminals can be integrated, but thickness variations and warpage become more severe, leading to inconsistent terminal alignment
Solution Approach 1:
The elastic body in the head structure can deform to accommodate the increased thickness variations and warpage that occur with larger chip sizes. This flexibility ensures that even as chip dimensions increase and manufacturing variations become more pronounced, the pressing force remains evenly distributed across all terminals, maintaining alignment consistency throughout the chip surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables consistent and reliable joining of terminals across the semiconductor chip surface, even with variations in thickness and warpage, ensuring electrical conduction and rigidity while preventing physical disruption, regardless of chip size.
Implementation Method 1
a head 2 includes a diaphragm 23 and an elastic body 24 that deforms in accordance with a shape of the semiconductor chip 11A
Implementation Method 2
a sucking unit that sucks up the semiconductor chip to bring the semiconductor chip into close contact with the contact unit
Implementation Method 3
heating the semiconductor chip 11A, to break through the reinforcing resin 105
Data Source
AI summary
A semiconductor mounting apparatus includes a storing unit that stores a liquid or a gas, a contact unit that comes into contact with a semiconductor chip when the storing unit is filled with the liquid or the gas, and a sucking unit that sucks up the semiconductor chip to bring the semiconductor chip into close contact with the contact unit.