Chip Package T-Contact via Redistribution Layer
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Solution Overview
Problem
Conventional chip packaging methods are costly and prone to damage due to the need for thick silicon substrates, which increases material costs and can lead to reduced sensing capabilities, such as fingerprint pressure sensing, and are susceptible to contamination and physical damage from user interaction.
Innovation Solution
A chip package design featuring a substrate with a sensing device and conducting pad, where a dam layer, permanent adhesive layer, support, buffer layer, redistribution layer, and passivation layer are used to create a T-contact electrical connection, allowing for a thin substrate and reduced material costs, while a protection layer with high hardness protects against contamination and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thick silicon substrate is used to prevent the chip package from being broken and damaged in manufacturing, then the strength and reliability of the chip package is improved, but the material cost is increased and the sensing capability is reduced
Solution Approach 1:
The invention divides the support function into multiple components: a thin silicon substrate for sensing, a buffer layer for stress management, and a separate support substrate for mechanical strength. This segmentation allows each layer to be optimized for its specific function without requiring the entire substrate to be thick, thereby reducing material cost while maintaining package strength.
Solution Approach 2:
The invention uses a composite structure combining silicon substrate, buffer layer, and support substrate. This composite material approach provides both the mechanical strength needed for manufacturing and the thin profile required for sensing capability, resolving the contradiction between strength and substrate thickness.
2Reliability
If wire-bonding process is used to electrically connect the conducting pad to the printed circuit board, then the electrical connection is reliable, but the manufacturing cost is high and the chip package occupies more space
Solution Approach 1:
The invention extracts the electrical connection function from the traditional wire-bonding process and integrates it directly into the chip package structure through conductive vias and redistribution layers. This eliminates the need for separate wire-bonding steps, reducing manufacturing cost and occupied space while maintaining reliable electrical connection.
Solution Approach 2:
The invention merges the electrical connection function with the chip package structure itself by forming conductive paths through the substrate and using the package layers as interconnection media. This consolidation eliminates the need for separate wire-bonding components and processes, reducing both cost and complexity.
3Reliability
If the sensing device is exposed without adequate protection, then the sensing capability is maintained, but the sensing device is susceptible to contamination and physical damage from user interaction
Solution Approach 1:
The invention uses a thin encapsulation layer that acts as a protective shell over the sensing device. This thin film provides protection against contamination and physical damage while maintaining the sensing capability, as it is thin enough to allow sensor operation but sufficient to provide environmental protection.
Solution Approach 2:
The invention applies a protection layer with high hardness before the sensing device is exposed to the environment. This preliminary protective action prevents contamination and physical damage from occurring in the first place, rather than attempting to clean or repair damage after it occurs.
Data Source
AI summary
A chip package includes a chip, a dam layer, a permanent adhesive layer, a support, a buffer layer, a redistribution layer, a passivation layer, and a conducting structure. A conducting pad and a sensing device of the chip are located on a first surface of a substrate of the chip, and the conducting pad protrudes from the side surface of the substrate. The dam layer surrounds the sensing device. The permanent adhesive layer is between the support and the substrate. The support and the permanent adhesive layer have a trench to expose the conducting pad. The buffer layer is located on the support. The redistribution layer is located on the buffer layer and on the support, the permanent adhesive layer, and the conducting pad facing the trench. The passivation layer covers the redistribution layer, the buffer layer, and the conducting pad.