Molded Circuit Board Light Window for Camera Modules
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Solution Overview
Problem
Conventional molded packaging technologies for camera modules face challenges in mass production due to deformation and damage during the molding process, and they do not effectively manage stray light, which degrades imaging quality.
Innovation Solution
A camera module with a molded circuit board assembly that features a molded base with inclined surfaces to reduce friction and damage during demolding, and a light window design that minimizes stray light impact, allowing for efficient mass production and improved optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a vertical prismatic column shaped through-hole is formed in the encapsulation portion, then a light path is provided for the photosensitive chip, but the encapsulation portion deforms and damages during demolding
Solution Approach 1:
The patent replaces the vertical prismatic column shaped through-hole with a curved surface structure. The encapsulation portion features a curved surface that provides the light path while avoiding sharp edges and corners that cause stress concentration during demolding. This curvature design allows the molding block to be detached without causing deformation or damage to the encapsulation portion.
2Volume of moving object
If molded packaging technology is used to reduce camera module size, then compactness is improved, but deformation and damage occur during the molding process
Solution Approach 1:
The patent introduces curved surfaces in the encapsulation portion design to replace sharp geometric features. This curvature prevents stress concentration during the molding and demolding processes, thereby maintaining shape accuracy and preventing deformation while still achieving compact camera module dimensions.
Solution Approach 2:
The patent designs the encapsulation portion with pre-formed curved surfaces that are optimized for the molding process. This preliminary design consideration ensures that the encapsulation portion can be successfully molded and demolded without deformation, addressing manufacturing precision issues before actual production.
3Ease of manufacture
If conventional holder-type COB packaging is used, then manufacturing is simpler, but the occupied space of electronic components is larger
Solution Approach 1:
The patent merges the holder function with the encapsulation portion itself. The molded base integrates both the encapsulation and support functions, eliminating the need for separate holders while reducing overall component occupied space. This integration maintains manufacturing simplicity while achieving compact dimensions.
Data Source
AI summary
A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.


