Circuit Board Module Slots for Stress Distribution
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Solution Overview
Problem
Existing methods for preventing moisture and dust ingress into electronic devices outdoors are inadequate, leading to unsatisfactory protection and solder joint issues, such as solder cracks, when circuit boards are assembled to cases.
Innovation Solution
A circuit board module design featuring slots that allow for the movement of fixing elements parallel to the board's surface, enabling the case to rotate and distribute assembly stress, thereby preventing solder cracks and enhancing sealing with a rotating nut and sealing ring system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If protection washers are installed between electronic connectors and case bodies to prevent moisture and dust ingress, then sealing performance is improved, but solder joints may encounter solder cracks during assembly
Solution Approach 1:
The patent introduces a rotating nut mechanism that allows dynamic adjustment during assembly. The nut can rotate to accommodate case body rotation, dynamically distributing assembly stress away from the solder joints while maintaining sealing pressure on the protection washers, thus preventing both solder cracks and moisture/dust ingress
Solution Approach 2:
The protection washers serve as intermediary sealing elements between the electronic connector and case body. Combined with the rotating nut mechanism, they provide a buffer layer that prevents direct stress transmission to solder joints while maintaining environmental sealing
2Object-affected harmful factors
If case bodies are assembled to electronic connectors with protection washers, then sealing is enhanced, but assembly stress causes solder cracks
Solution Approach 1:
The rotating nut mechanism provides dynamic stress distribution during assembly. As the case body is assembled, the nut can rotate to accommodate misalignment and distribute assembly stress away from the vulnerable solder joints, preventing solder cracks while maintaining sealing force on the protection washers for environmental protection
3Stability of the object's composition
If fixed assembly methods are used to secure circuit boards to cases, then assembly stability is improved, but stress concentration causes solder cracks
Solution Approach 1:
The rotating nut mechanism transforms fixed assembly into a dynamic process. During assembly, the nut rotates to accommodate case body rotation and distribute stress evenly, avoiding stress concentration at solder joints. After assembly, the system maintains stability with the nut secured in its final position, thus achieving both assembly stability and solder joint reliability
Data Source
AI summary
A circuit board module for being assembled to a case is provided. The circuit board module includes an electronic connector and a circuit board. The electronic connector is fixed to the circuit board. The circuit board has at least one first slot. The at least one first slot is configured for a fixing element to pass through and for the circuit board to be assembled to a case. The size of the at least one first slot allows the fixing element to move in a direction parallel to a surface of the circuit board in the at least one first slot. An electronic device having the circuit board module is also provided.