Plated Standoff for Circuit Board Solder Joint Height Control
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Solution Overview
Problem
Existing approaches to mounting circuit packages on circuit boards often result in unreliable solder joints and voids, which can compromise the mechanical strength and electrical integrity of the interface.
Innovation Solution
The implementation of a circuit board with an electrically-conductive pad and a plated standoff formed on its surface, which provides a mechanical standoff between the circuit board and the circuit package after a solder reflow process, thereby increasing the thickness of the solder joint and reducing voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional screen-printing solder technology is used to mount BTC packages, then the manufacturing process is simple and easy to implement, but the solder joint height is limited to 1.0-1.5 mils resulting in unreliable solder joints and increased void formation
Solution Approach 1:
The patent applies preliminary action by forming plated standoffs on the circuit board pads before the solder reflow process. These standoffs pre-establish the mechanical support structure and define the final solder joint height (2.0-4.0 mils), ensuring reliable solder joints and proper flux residue escape paths are achieved without requiring complex real-time process control during reflow
Solution Approach 2:
The plated standoff acts as an intermediary element between the circuit board pad and the BTC package. It provides mechanical support and defines the solder joint height, mediating the connection between the board and package while enabling flux residue escape and reducing void formation without requiring complex manufacturing processes
2Reliability
If solder joint height is increased to 2.0-4.0 mils to improve reliability and allow flux residue escape, then solder joint reliability and void reduction are improved, but the manufacturing process complexity increases
Solution Approach 1:
The plated standoffs are formed in advance during PCB fabrication using standard plating processes, pre-establishing the desired solder joint height (2.0-4.0 mils) before assembly. This preliminary action enables flux residue escape and reliable solder joints without requiring complex real-time process control during reflow
Solution Approach 2:
The plated standoff structure is self-forming during the solder reflow process. The solder automatically flows around and adheres to the standoff, creating the final joint geometry without requiring additional manufacturing steps or complex process control. The standoff itself provides the mechanical support and defines the joint height
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances solder joint reliability and reduces voids, leading to improved mechanical strength and electrical performance of the interface between the circuit package and the circuit board.
Implementation Method 1
a plated standoff plated onto a surface of the electrically-conductive pad
Data Source
AI summary
An information handling resource may include a circuit board comprising an electrically-conductive pad and a plated standoff plated onto a surface of the electrically-conductive pad.