C-Shaped Confinement Liner for Plasma Chamber
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Solution Overview
Problem
In semiconductor substrate processing, unconfined plasmas lead to etch-byproduct deposition on chamber walls, causing contamination and particle issues, which necessitate additional downstream cleaning, reducing process throughput and increasing costs.
Innovation Solution
The use of C-shaped confinement liners with a contoured inner surface and radial slots to effectively confine the plasma within the processing region, made from materials like silicon carbide or polysilicon to reduce contamination and provide a ground path for RF power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If unconfined plasma is used in processing, then the plasma can cover larger area, but etch-byproduct deposition on chamber walls increases causing contamination and particle issues
Solution Approach 1:
A confinement liner is introduced as an intermediary component between the plasma and chamber walls. The liner is positioned to confine plasma within the processing region, preventing direct contact between plasma and chamber walls, thereby eliminating etch-byproduct deposition on walls while maintaining adequate plasma coverage area
Solution Approach 2:
The confinement liner is divided into multiple segments including an upper liner and a lower liner with radial slots. This segmentation allows the liner to effectively confine plasma in the processing region while permitting necessary gas flow and plasma passage through the radial slots, achieving both plasma confinement and adequate coverage
2Object-generated harmful factors
If confinement liner is added to control plasma, then etch-byproduct deposition is reduced, but device complexity increases
Solution Approach 1:
The confinement liner is designed as a thin-walled structure with radial slots that can flexibly adapt to the chamber geometry. This thin-film approach provides effective plasma confinement without adding significant structural complexity or weight to the chamber system
Solution Approach 2:
The lower liner incorporates radial slots that function as a porous structure, allowing gas flow and plasma passage while maintaining the confinement function. This slot design reduces structural complexity compared to a fully solid barrier while achieving the desired plasma control
3Object-generated harmful factors
If additional downstream cleaning is implemented to remove particles, then particle issues are addressed, but process throughput decreases
Solution Approach 1:
The confinement liner performs preliminary action by preventing etch-byproduct deposition on chamber walls during the processing step itself. By confining plasma and preventing wall contact beforehand, the liner eliminates the source of particles that would otherwise require downstream cleaning removal, thereby maintaining high process throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively confines the plasma, minimizing etch-byproduct deposition on chamber walls, reducing contamination and particle issues, and enhancing process efficiency by maintaining a clean environment and reducing the need for additional downstream cleaning.
Implementation Method 1
made from materials like silicon carbide or polysilicon to reduce contamination and provide a ground path for RF power
Implementation Method 2
the lower liner extends radially inward from the tubular body and includes a plurality of radial slots arranged around the lower liner
Data Source
AI summary
Embodiments of liners for use in a process chamber are provided herein. In some embodiments, a liner for use in a process chamber includes an upper liner having a top plate with a central opening and a tubular body extending downward from an outer peripheral portion of the top plate, wherein the top plate has a contoured inner surface having a first step with a first inner diameter and a second step with a second inner diameter greater than the first inner diameter, and wherein the tubular body has an opening for transferring a substrate therethrough; and a lower liner abutting a bottom surface of the tubular body, wherein the lower liner extends radially inward from the tubular body and includes a plurality of radial slots arranged around the lower liner, wherein the upper liner and the lower liner form a C-shaped cross-section.