Communications Cabinet Heat Loop Layout for Dense Plugboard Cooling
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Solution Overview
Problem
Existing communications devices face poor heat dissipation effects due to high air resistance, low air speed regions, and constrained heat sink areas, leading to inefficient heat dissipation and limited device capacity.
Innovation Solution
A heat dissipation cabinet with a heat exchange loop comprising evaporators and condensers connected by pipelines, where evaporators are in thermal contact with heat source components, and condensers are located above them, forming a loop with refrigerating working substances that circulate to dissipate heat through air cooling, with condensers acting as a centralized heat dissipation resource pool.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan and heat sink are used for heat dissipation in the slot space, then heat can be transferred from the chip, but the air resistance is large and the heat dissipation effect is poor
Solution Approach 1:
The patent extracts the condenser from the constrained slot space and relocates it to the cabinet body's air duct. This separation removes the harmful interaction between the condenser and slot components that caused high air resistance, while maintaining the heat dissipation function through the refrigerating cycle system.
Solution Approach 2:
The patent transitions from two-dimensional heat dissipation within the slot space to three-dimensional heat dissipation utilizing the cabinet body's air duct space. The condenser is positioned in the air duct above the evaporator, creating a vertical heat exchange loop that充分利用 the cabinet's internal volume and improves air flow characteristics.
2Temperature
If the condenser is placed in the slot space, then heat exchange can occur, but the heat dissipation area is constrained by slot spacing and layout
Solution Approach 1:
The condenser is extracted from the constrained slot space environment and relocated to the more spacious air duct in the cabinet body. This extraction frees the condenser from spatial constraints imposed by slot spacing and plugboard layout, allowing for a larger heat dissipation area.
Solution Approach 2:
The air duct in the cabinet body serves multiple functions: it provides a pathway for refrigerating working substances, accommodates the condenser with sufficient space, and facilitates efficient heat dissipation. This multi-functional use of the air duct space resolves the contradiction between heat dissipation area requirements and available space constraints.
3Quantity of substance
If components are densely arranged in the slot space, then device capacity increases, but the air flow efficiency decreases and low air speed regions form
Solution Approach 1:
The condenser is extracted from the densely packed slot space and relocated to the air duct. This separation maintains the dense component arrangement in the slot space for high device capacity, while the air duct provides an unobstructed pathway for efficient air flow and heat dissipation without low air speed regions.
4Ease of operation
If the air duct is made long to accommodate components, then device functionality is achieved, but system resistance increases and fan efficiency decreases
Solution Approach 1:
The patent utilizes the vertical dimension of the cabinet body's air duct to position the condenser above the evaporator. This vertical arrangement creates a more direct and shorter heat exchange loop compared to horizontal extensions, reducing the overall length of the air duct required and thereby decreasing system resistance and energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces air resistance, enlarges the heat dissipation area, and improves convective heat exchange, allowing for rapid and efficient heat dissipation, even in systems with uneven heat distribution, while increasing device capacity by accommodating more plugboards.
Implementation Method 1
The evaporator is configured to be in thermal contact with an outer surface of one or more heat source components... Heat generated during working of the heat source component is transferred to the refrigerating working substance in the evaporator. The refrigerating working substance in the evaporator changes from a liquid state to a gas state after absorbing the heat.
Implementation Method 2
The refrigerating working substance in the gas state rises into the condenser along the evaporation pipeline. The refrigerating working substance in the condenser releases heat and changes into the refrigerating working substance in the liquid state... The fan is configured to dissipate heat of the condenser through air cooling.
Data Source
AI summary
A heat dissipation cabinet includes a cabinet body and a heat dissipation apparatus. A first accommodation region of the cabinet body can accommodate a plugboard in a stacked manner, and heat source components of the plugboard dissipate heat through the heat dissipation apparatus. An evaporator, a condenser, and an evaporation pipeline of the heat dissipation apparatus are connected to a liquid return pipeline to form a heat exchange loop, and the evaporator is in thermal contact with an outer surface of a heat source component. The condenser is disposed in a second accommodation region and located above the evaporator. A refrigerant flows in the heat exchange loop, to draw heat of the heat source component far to the condenser, and take away heat of the condenser using air generated by a fan. A second accommodation region is used as an independent air duct whose path is relatively short.