Modifications Using Liquid Cooling TRIZ Cases

See how a parallel condenser layout with pump control enables valve-free switching between pass

See how a CO2 refrigerant loop with Venturi pressure reduction and modular heat exchangers remo

See how an evaporative cooler with pre-cooler and recovery coil reduces data center energy cons

Reinforcement in the condensation zone preserves panel rigidity while guiding water refrigerant for compact phase-change heat dissipation.

A reinforced condensation zone helps a thermal panel use water and SUS for effective heat dissipation with lower cost and simpler structure.

Pulsating heat pipes embedded in fins and casing spread heat across electric aircraft electronics for more uniform cooling and airflow-based dissipation.

Adjustable louvers and zoned fins direct airflow to hotter chiplets, improving MCM cooling efficiency while reducing fan energy and noise.

Through-substrate thermal vias and a rear heat pipe remove heat efficiently while limiting lateral heat spread between nearby components.

Vertical and horizontal wicking channels with boiling-enhancement coating improve two-phase heat spreading where vapor limits cooling.

An embedded heat pipe and finned busbar remove contact heat in large circuit breakers without adding external cooling parts or extra space.

Dual fluid cooling uses liquid for server hot spots and a separate secondary loop for peripherals to raise heat removal beyond air-cooling limits.

Multiple cooling tanks use separation and coolant distribution panels to improve heat dissipation, lower PUE, and simplify maintenance.

A bypass valve varies coolant flow in a capillary cooler to start evaporative cooling earlier, cut pump power use, and limit vapor pressure buildup.

An evaporative pad and sensor-based pump and fan control cut datacenter cooling water use, noise, and power without direct spraying.

Localized fluid passages cool high-heat-flux zones in power modules, improving temperature control, flow balance, and reliability.

A separated evaporator-condenser loop moves chip heat into a short cabinet air duct, cutting resistance and improving cooling for dense plugboards.

Stacked vapor chambers linked by heat pipes and boiling structures improve high-power electronic cooling while cutting superheat and thermal resistance.

Distributed oil-free compressors and phase change storage cool high-density server cabinets while shifting cold capacity to lower-cost energy periods.

A sealed evaporative enclosure uses wick-fed coolant and vapor reuse to cool electronics without the weight and mounting limits of immersion cooling.

Recessed heat reception zones and capillary refrigerant transport improve boiling, condensation, and cooling of heat-generating elements.

Temperature-triggered air and water cooling in a controller cover improves heat removal while limiting moisture ingress risk.

A slide rail lets the condenser move above the coolant for better vapor condensation, then shift aside for safer repair access.

Non-potable wastewater is treated in trickling filters and reused for evaporative data center cooling to cut water and energy use under variable loads.

Controlled evaporating and pool volumes prevent dry out and flooding, enabling pump-free cooling for high-power computing components.

Sensors and closed-loop control combine Peltier plates with a refrigerant cycle to cool electronic hot spots quickly without condensation.

Enclosed piping bends and leak sensors isolate flammable refrigerant from cabinet air, reducing ignition risk during cooling.

A single-phase immersion tank uses natural convection and an immersed condenser to cool high-power boards without stringent sealing.

A hybrid adiabatic loop switches between free cooling and chiller operation to cut data center energy and water use.

A porous PVA foam suction unit draws liquid into the vapor space to speed two-phase heat exchange, cut coolant use, and even out temperature.

Triangular flow guides and a valve separate water from immersion coolant after maintenance, restoring stable evaporation and condensation.

High-SA/V microtubes boost coolant heat transfer in cold plates, helping dense electronic components avoid overheating and performance loss.

Targeted immersion cools heat-generating components, while sealed pressure chambers control boiling and reduce fluid use and Leidenfrost effects.

A 0.1–0.5 mm heat-conducting layer maintains close attachment while finned surfaces expand heat exchange for vehicle electronics.

A flexible ribbon links evaporator and condenser to dissipate heat passively, avoiding fans, pumps, and fluid connections in dense electromechanical packaging.

High-power servers use vapor chambers and MEMS jets to dissipate heat with compact, low-noise cooling and no fan-based moving parts.

Solid-state thermal material simplifies heat-sink filling, then melts during operation to bridge gaps and conduct heat from electronic elements.

An AHU independently wets evaporative-media subregions to target high-heat zones, limit wasted cooling, and prevent thermal damage.

Ambient-temperature switching enables free cooling before chiller operation, reducing energy and water use while serving air-handling and direct-liquid data-center loads.

Hot and cold thermal sinks vaporize or condense two-phase fluid to stabilize immersion-tank pressure as compute heat changes.

Liquid refrigerant from an HVAC condenser cools power electronics through internal pathways, while fins provide air convection when circulation is limited.