Reinforced Refrigerant Panel for Water-Based Phase-Change Cooling
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material restrictions, and increased product size, while refrigerant-based systems face challenges with pressure regulation and environmental regulations, limiting the use of water as a refrigerant.
Innovation Solution
An active heat dissipation apparatus with a thermal conduction panel body featuring a refrigerant flow space and reinforcement portions, using SUS material with lower thermal conductivity, and incorporating a refrigerant flow path design that includes line and dot reinforcement portions to enhance rigidity and guide refrigerant flow, allowing for efficient phase change and pressure equilibrium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy materials are used for heat dissipation fins, then thermal conductivity is improved, but material cost and environmental compliance are worsened
Solution Approach 1:
The patent uses refrigerant phase change (liquid-gas transition) as the core heat dissipation mechanism, replacing traditional thermal conduction materials. The refrigerant absorbs heat during vaporization and releases it during condensation, achieving superior heat dissipation performance without relying on high-cost or environmentally problematic materials like certain aluminum alloys
Solution Approach 2:
The patent changes the heat dissipation mechanism from thermal conduction (material property) to phase change (physical process). By controlling refrigerant phase transitions, the system achieves adjustable heat dissipation parameters while using environmentally friendly materials, resolving the contradiction between performance and environmental compliance
2Temperature
If refrigerant-based heat dissipation systems are used, then heat dissipation performance is improved, but pressure regulation complexity and environmental compliance are worsened
Solution Approach 1:
The refrigerant system operates autonomously using natural phase change processes. The refrigerant automatically circulates between vaporization and condensation states based on temperature differences, eliminating the need for complex pressure regulation mechanisms, pumps, or external control systems
Solution Approach 2:
The patent replaces mechanical pressure regulation systems with passive thermodynamic processes. Instead of using pumps, valves, or pressure controllers, the system relies on natural convection and phase change to achieve heat dissipation, significantly reducing device complexity
3Temperature
If thermal conduction materials with higher conductivity are used, then heat dissipation performance is improved, but product size increases
Solution Approach 1:
The refrigerant phase change process concentrates heat absorption and release in specific zones (vaporization zone and condensation zone), enabling efficient heat dissipation in a compact form. The phase change occurs at constant temperature, maximizing heat transfer density without requiring large material volumes
Solution Approach 2:
The patent transitions from two-dimensional thermal conduction through materials to three-dimensional refrigerant circulation within enclosed spaces. The refrigerant flow paths are configured to maximize heat exchange surface area within a compact volume, achieving superior heat dissipation performance without increasing product size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved heat dissipation performance, reduced manufacturing costs, and compliance with environmental regulations by using water as a refrigerant, while maintaining effective heat transport and minimizing thermal concentration.
Implementation Method 1
a first refrigerant flow path positioned to be adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase
Implementation Method 2
a plurality of strength reinforcement portions formed in a condensation zone excluding the vaporization zone of the first refrigerant flow path
Data Source
Figure 1
Figure 2(1)~2(5)
Figure 3
AI summary
The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, the refrigerant flow space being formed in the thermal conduction panel body by bending or joining at least one metal panel member, in which the refrigerant flow space includes a first refrigerant flow path positioned adjacent to a press-fitting portion provided in a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone excluding the vaporization zone of the first refrigerant flow path and configured to reinforce rigidity of the thermal conduction panel body configured to define one side surface and the other side surface of the refrigerant flow space, thereby significantly improving heat dissipation performance.